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Technology Stocks
An SI Board Since December 2010
Posts SubjectMarks Bans Symbol
31177 213 0 AMD
Emcee:  neolib Type:  Moderated
Update on 8/16/16: At IDF, Intel announced they are broadly licensing and supporting ARM IP on their 10nm Foundry process, and presumably going forward. Having thrown in the towel on mobile SoC's and Contra Revenue earlier this year, this would appear to be RIP for x86 in both mobile and likely IoT. Instead, Intel appears to want to compete with the Foundries for the wafer volume those markets offer. Since it takes years to build IP and customer relationships, and Intel has a checkered history of being a reliable partner and silicon scaling is near the end, this will be a very interesting development to watch over the next 5-10 years.

Update on 1/28/16: TSMC & Samsung both exited 2015 in high volume FinFET production, while AMD is scheduled for mid-16 on GF's FinFETs. TSMC will start 10nm customer tapeouts in 1Q16 and production by 4Q16. The PC industry remains in contraction, now entering the 5'th year of decline, and mobile is showing hints of peaking as well. The big question for '16 is whether any new high volume applications for semis emerge. Automotive, wearables, VR, and drones are potentials that might develop in 2016.

Update on 3/6/15: With confirmation from WMC that Samsung will ship two devices with 14nm FinFET SoCs starting April 10, 2015, it is finely becoming clear how drastically the Foundries have closed the process gap with Intel. An interesting question now for 2015 is when the combination of Samsung/GF and TSMC will surpass Intel in wafer area on FinFET processes on a quarterly basis. My guess is that Q4'15 sees this milestone occur.

Update on 2/26/15: With WMC a few days away, it is widely anticipated that Samsung will debut 14nm SoCs into a very high volume product: The Galaxy S6. With an expected ramp for Apple A9 SoCs in Q2, and likely some additional SoC volume from Qualcomm, it would appear that Samsung will ship more CPUs at 14nm than Intel in 2015. Intel might possibly ship more wafer area at 14nm, but data on that is difficult to obtain. The mobile SoC's are as big or bigger than the lower end higher volume PC CPUs, and so far, Intel's slow ramp of 14nm product has not progressed well for the large die devices.

Update on 8/6/14: Since this board was started, the CPU space has changed considerably, and so has the semi Foundry space. The AMD/Intel competition in x86 processors has been replaced with x86 vs ARM as computing has increasingly shifted to mobile form factors. Intel has made a significant shift to use their leading edge process advantage as a Foundry. The huge volumes in mobile now dominate leading edge wafer production, and competition is fierce to land Apple's orders between TSMC and Samsung. Intel has struggled to launch 14nm, and the Foundries are making a determined effort to close the gap with Intel on process tech. What happens in late 2014 and through 2015 for 14/16nm FinFET processes now looks like the big story in semiconductors in the next year+.

While the x86 CPU contest between AMD & Intel has grown old, exciting things are happening in the CPU and graphics world. The age of APUs in the x86 world has begun, with both AMD and Intel rolling out new families in early 2011. Meanwhile, 2010 saw the explosive launch of tablet PC's, mostly powered by non-x86 designs, and running non-MSFT OSes and software. What will 2011 bring to the CPU/GPU world?

This is a moderated board. All views are welcomed, but please restrict posts to useful content about CPUs, GPUs, the companies involved, or related market conditions. Attacking/baiting other posters, and snark in general will lead to banning.

Additional Comment: The companies working in this space have talented engineers & managers, and while we all may have our views on them, please refrain from endless bashing of them, as it does not contribute much useful to the board.
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31177pcgamesn.comrzborusaan hour ago
31176was project engineer for first custom ASICs for Qualcomm CDMA chipset. Designed engineer2 hours ago
31175> I miss doing custom cell layout and design. was the funnest part of my careVattila3 hours ago
31174Thanks. > I expect the metal etch widths to stop going down and that metal eVattila3 hours ago
31173been 15 years since I was into process science, but I think it all depends on thengineer3 hours ago
31172> I am not talking about timing critical, [...] I am thinking more about yielVattila3 hours ago
31171I am not talking about timing critical, I am talking about having enough drive sengineer4 hours ago
31170Eve Considering AMD, Intel for New Eve V2, Aiming for 2020 Launch "Eve (foVattila5 hours ago
31169> The variations on the FET performance was somewhat evened out with the multVattila5 hours ago
31168wow.....down to single Fin. That is pretty aggressive. The variations on the FETengineer6 hours ago
31167> Robert Haddock That should be Hallock. Sorry, Robert. :-)Vattila8 hours ago
31166When and if they do, they will spin off their fabs into a separate company. Whiccombjellyyesterday
31165By the way, here is derBauer talking more about frequency and PBO in his first RVattilayesterday
31164As more reviews, experience and evidence emerges for the Ryzen 3000 boosting behVattilayesterday
31163Government Approved AMD’s China Exports July 21, 2019 9:56 am ET bit3yesterday
31162Is BFloat16 something that belongs in an accelerator or in a general-purpose corVattilayesterday
31161$15460 for the new Xeon 8284 - [graphic] anandtech.combit3yesterday
31160They could roll their own I/O if they're chiplet design shows up ...rzborusaSaturday
31159IMHO, they will start going fablite..., but that means plenty of employees go asneolibSaturday
31158> IMHO, this again points out AMD's wise design decisions, in that they drzborusaSaturday
31157I guess Bob Swan is a glass half full guy. Lol. crn.comgvattySaturday
31156www.nextplatform.comIntel Prepares To Graft Google’s Bfloat16 Onto Processors 6FUBHOSaturday
31155Interesting. With the huge challenges that further scaling faces, AMD is in a goVattilaSaturday <i>SAN JOSE, Calif. — Chief executives of Arm, Micron, and XineolibSaturday
31153AMD Joins Consortia to Advance CXL, a New High-Speed Interconnect for BreakthrouVattilalast Friday
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