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Technology Stocks
AMD, ARMH, INTC, NVDA
An SI Board Since December 2010
Posts SubjectMarks Bans Symbol
30733 211 0 AMD
Emcee:  neolib Type:  Moderated
Update on 8/16/16: At IDF, Intel announced they are broadly licensing and supporting ARM IP on their 10nm Foundry process, and presumably going forward. Having thrown in the towel on mobile SoC's and Contra Revenue earlier this year, this would appear to be RIP for x86 in both mobile and likely IoT. Instead, Intel appears to want to compete with the Foundries for the wafer volume those markets offer. Since it takes years to build IP and customer relationships, and Intel has a checkered history of being a reliable partner and silicon scaling is near the end, this will be a very interesting development to watch over the next 5-10 years.

Update on 1/28/16: TSMC & Samsung both exited 2015 in high volume FinFET production, while AMD is scheduled for mid-16 on GF's FinFETs. TSMC will start 10nm customer tapeouts in 1Q16 and production by 4Q16. The PC industry remains in contraction, now entering the 5'th year of decline, and mobile is showing hints of peaking as well. The big question for '16 is whether any new high volume applications for semis emerge. Automotive, wearables, VR, and drones are potentials that might develop in 2016.

Update on 3/6/15: With confirmation from WMC that Samsung will ship two devices with 14nm FinFET SoCs starting April 10, 2015, it is finely becoming clear how drastically the Foundries have closed the process gap with Intel. An interesting question now for 2015 is when the combination of Samsung/GF and TSMC will surpass Intel in wafer area on FinFET processes on a quarterly basis. My guess is that Q4'15 sees this milestone occur.

Update on 2/26/15: With WMC a few days away, it is widely anticipated that Samsung will debut 14nm SoCs into a very high volume product: The Galaxy S6. With an expected ramp for Apple A9 SoCs in Q2, and likely some additional SoC volume from Qualcomm, it would appear that Samsung will ship more CPUs at 14nm than Intel in 2015. Intel might possibly ship more wafer area at 14nm, but data on that is difficult to obtain. The mobile SoC's are as big or bigger than the lower end higher volume PC CPUs, and so far, Intel's slow ramp of 14nm product has not progressed well for the large die devices.

Update on 8/6/14: Since this board was started, the CPU space has changed considerably, and so has the semi Foundry space. The AMD/Intel competition in x86 processors has been replaced with x86 vs ARM as computing has increasingly shifted to mobile form factors. Intel has made a significant shift to use their leading edge process advantage as a Foundry. The huge volumes in mobile now dominate leading edge wafer production, and competition is fierce to land Apple's orders between TSMC and Samsung. Intel has struggled to launch 14nm, and the Foundries are making a determined effort to close the gap with Intel on process tech. What happens in late 2014 and through 2015 for 14/16nm FinFET processes now looks like the big story in semiconductors in the next year+.

While the x86 CPU contest between AMD & Intel has grown old, exciting things are happening in the CPU and graphics world. The age of APUs in the x86 world has begun, with both AMD and Intel rolling out new families in early 2011. Meanwhile, 2010 saw the explosive launch of tablet PC's, mostly powered by non-x86 designs, and running non-MSFT OSes and software. What will 2011 bring to the CPU/GPU world?

This is a moderated board. All views are welcomed, but please restrict posts to useful content about CPUs, GPUs, the companies involved, or related market conditions. Attacking/baiting other posters, and snark in general will lead to banning.

Additional Comment: The companies working in this space have talented engineers & managers, and while we all may have our views on them, please refrain from endless bashing of them, as it does not contribute much useful to the board.
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30733Samsung is going to fab 14nm CPUs for Intel businesskorea.co.kr guru3d.com apbit35 hours ago
30732Yeah, I'm wondering about the fab-heavy part. Could this delay be the tip oneolibyesterday
30731Ultra-segmentation and Fab-Heavy must be really hurting Intel right now... fpgfastpathguruyesterday
30730Yet Intel has "shortages"...neolibyesterday
30729"Apple is also reportedly building its own 5G chips to launch in either 202Jamie153yesterday
30728 Intel Postpones Construction of New Israeli Factory calcalistech.combit3yesterday
30727Navi seems popular with miners. Rome should have some long coat tails. Not a lrzborusaSunday
30726Worth a watch: youtube.comPravin KamdarSunday
30725Interestingly for those who don't know the I O chips from AMD start with allrzborusalast Saturday
30724Which is sort of where I am going with this. By making all of their product linecombjellylast Saturday
30723One wonders why they couldn't let customers do this too, and sell them the cneoliblast Saturday
30722And what would via hole diameter be, and how are they made. How are the layers acombjellylast Saturday
30721so called high density interconnect pcbs have become very high volume business dneoliblast Saturday
30720A few years ago, 10 or 15, a few, I was experimenting with a waste oil burner anrzborusalast Saturday
30719They said it was a 12 layer board, and the bump pitch for the interconnects is 1neoliblast Saturday
30718>, but Intel has a more diverse workforce! I think the word you're lookirzborusalast Saturday
30717Semiconductors: Inventory Remains Elevated: Reported Date 6/10/19 [graphic]bit3last Saturday
30716AMD may have better processors on a better process, but Intel has a more diverseFUBHOlast Saturday
30715[graphic] The World’s Best CEOs of 2019 reddit.com barrons.combit3last Saturday
30714reddit.comPravin Kamdarlast Saturday
30713in principle, yes. I don't know what the software stack is, nor what the worcombjellylast Friday
30712Its just a very high density pcb. But they did say there are only two suppliersneoliblast Friday
30711It also makes "custom" chips a lot easier to do. I have no idea what tcombjellylast Friday
30710Not to mention, that the same CPU chiplet is used in all of AMD CPUs from low enneoliblast Friday
30709IMO the best reason for chiplets is to get heat out of the area of the CPU. I&#Pravin Kamdarlast Friday
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