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To: neolib who wrote (42960)9/24/2021 12:32:37 PM
From: rzborusaRespond to of 44245
What a story, complete with twists.

On a lighter note this poster from Yahoo makes some interesting gibble gabble, a reasonable summary er humorous ...:

ozymandias15 hours ago
$AMD conversation

Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which is expected to help the US chipmaker significantly drive up its shipments.

ABF = Ajinomoto Bonding Fluid. used for stacking 3D chips. Notice $INTC is not mentioned. You cannot stack monolithic 450 Watt ovens.

ABF is used mostly for GPU and servers and APUs. AMD targets super computers, servers, and thin light notebooks.

Notice the whole Island of Taiwan is supporting their favorite lady, Doctor Lisa Su. Taiwan can replace Intel.

Intel has a new business plan under Pat 'the mouth' Gelsinger. Intel plans to build low margin auto parts. That's the plan. No customers yet. Yugo is negotiating.