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Technology Stocks : Cree Inc. -- Ignore unavailable to you. Want to Upgrade?

To: slacker711 who wrote (10442)9/10/2021 9:27:27 AM
From: slacker7111 Recommendation

Recommended By
Lou Weed

  Respond to of 10481
Also, the die shrink noted by X-fab with their Gen 3 device reminds me that we are due to see Cree announce their Gen 4 devices. I believe the plan a few years ago was that they would make the transition to trench technology for this generation of devices. They are competitive with planar but my understanding is that they should see increased performance with trench but that they were working to increase the reliability.

To: slacker711 who wrote (10442)9/12/2021 7:33:31 PM
From: EvanG  Respond to of 10481
Maybe an opportunity here if IIVI has any success with their fabless model.

X-FAB and from my understanding Infineon as well, use the same fab to make Si and SiC. The high volume of Si helps lower the cost for SiC by keeping the fab highly utilized. X-FAB is using a 150mm BiCMOS fab. Infineon is using a 200mm fab.

Monolith Semiconductor, owned by Littelfuse now, is an X-FAB customer and put together the presentation linked below describing the process to get a Si fab to convert to running Si and SiC.

With X-FAB using a 150mm fab, not sure it meets II-VI goals. But it should be a matter of approaching a bunch of high volume 200mm fabs and see if one is willing to making tooling changes to work SiC as well.