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AMD and MediaTek reportedly in talks to form JV This joint venture that will be dedicated to developing SoC chips combining Wi-Fi, 5G and high transmission technologies for notebooks. This wouldn't be mobile graphics like some are reporting!$AMD$MRVL$AVGO$INTC$QCOMpic.twitter.com/dypZ9LBk1H
Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which is expected to help the US chipmaker significantly drive up its shipments.
ABF = Ajinomoto Bonding Fluid. used for stacking 3D chips. Notice $INTC is not mentioned. You cannot stack monolithic 450 Watt ovens.
ABF is used mostly for GPU and servers and APUs. AMD targets super computers, servers, and thin light notebooks.
Notice the whole Island of Taiwan is supporting their favorite lady, Doctor Lisa Su. Taiwan can replace Intel.
Intel has a new business plan under Pat 'the mouth' Gelsinger. Intel plans to build low margin auto parts. That's the plan. No customers yet. Yugo is negotiating.