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Technology Stocks AMD, ARMH, INTC, NVDA

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To: Joe NYC who wrote (42943)	9/23/2021 2:56:41 PM
From: Joe NYC	of 72232

Some old news: Report: AMD Taps MediaTek to Develop Custom Wi-Fi 6 and 5G Chips Edit: right now, I think the WIFI and network chips used in AMD mobos are Intel. tomshardware.com

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From: gvatty	9/23/2021 3:18:00 PM
	of 72232

Why didn't Microsoft use AMD for their new Surface models? I thought it's prior 1 AMD model was among the better choices.

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To: gvatty who wrote (42945)	9/23/2021 3:20:33 PM
From: rzborusa	of 72232

wccftech.com

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From: Joe NYC	9/23/2021 3:21:18 PM
	of 72232

AMD and MediaTek reportedly in talks to form JV This joint venture that will be dedicated to developing SoC chips combining Wi-Fi, 5G and high transmission technologies for notebooks. This wouldn't be mobile graphics like some are reporting!$AMD $MRVL $AVGO $INTC $QCOM pic.twitter.com/dypZ9LBk1H — Dylan Patel (@dylan522p) September 23, 2021

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To: gvatty who wrote (42945)	9/23/2021 3:29:33 PM
From: Joe NYC	of 72232

It's strange that Microsoft did not pick up Cezanne chip, but used prior generations...

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To: Joe NYC who wrote (42944)	9/23/2021 3:42:46 PM
From: neolib	of 72232

Ah, well that makes sense too. Remember AMD used a Taiwan or Chinese based design firm for their MB chips too.

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To: neolib who wrote (42949)	9/23/2021 5:21:22 PM
From: neolib	of 72232

ASMedia was the chipset designer. IIRC, they had some problems with either PCIe or DDR controllers at one point, and AMD took over designing one of the chipsets. I wonder if this MediaTek JV will be a problem for ASMedia? Sounds like MediaTek will be essentially doing (well AMD part if a JV) mobile chipsets for AMD. I don't know if ASMedia did any mobile work for AMD. Perhaps it was all DT MB chipsets.

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From: Joe NYC	9/23/2021 9:22:19 PM
	of 72232



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To: Joe NYC who wrote (42951)	9/24/2021 11:45:13 AM
From: neolib	of 72232

This development today may be somewhat positive for AMD/Xilinx: reuters.com

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To: neolib who wrote (42952)	9/24/2021 12:32:37 PM
From: rzborusa	of 72232

What a story, complete with twists. On a lighter note this poster from Yahoo makes some interesting gibble gabble, a reasonable summary er humorous ...: ozymandias15 hours ago $AMD conversation Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which is expected to help the US chipmaker significantly drive up its shipments. ABF = Ajinomoto Bonding Fluid. used for stacking 3D chips. Notice $INTC is not mentioned. You cannot stack monolithic 450 Watt ovens. ABF is used mostly for GPU and servers and APUs. AMD targets super computers, servers, and thin light notebooks. Notice the whole Island of Taiwan is supporting their favorite lady, Doctor Lisa Su. Taiwan can replace Intel. Intel has a new business plan under Pat 'the mouth' Gelsinger. Intel plans to build low margin auto parts. That's the plan. No customers yet. Yugo is negotiating.

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