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Which is sort of where I am going with this. By making all of their product line as chiplets, and having few I/O ones, AMD can offer a set of packaging services for customers that have enough volume. Outside vendors of other IP like networking, can produce chiplets with Infinity Fabric interconnects or maybe just PCIe X.Y that can be packaged along with AMD chiplets. Eventually others can do the same. Right now there are only two companies that can do this. Hopefully there could be more.
It would be nice to be able to go to a website and being able to select the chiplets and socket type you want. The company then would place and route it for you. A few weeks later you get some boxes with your design. I see no real reason it couldn't be done automatically.
With HBM, the circuit board would be reduced to low speed peripherals, connectors and power management.
Interestingly for those who don't know the I O chips from AMD start with all available interfaces for memory drives Etc and when some function of the chip is defective it is binned to the functions that are not defective. Making the yeild superb. This blew my mind.