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IMO the best reason for chiplets is to get heat out of the area of the CPU.
I'd say that is a really good benefit, but the best reason is chiplet yield -- vs monolithic large dies -- and all of the binning options that come with it. Also, chiplets allow you to update one kind of chiplet in the package without having to update an entire large monolithic die.
Not to mention, that the same CPU chiplet is used in all of AMD CPUs from low end DT to high end server. This time around it might be true of the APUs as well, but we don't actually know that yet. AMD has saved a lot of money having one common die.
It also makes "custom" chips a lot easier to do. I have no idea what the NREs are on an organic interposer, but it has got to be a whole lot less than a new mask set for a processor. Even if a new chiplet needs to be designed, the total costs are still a lot lower.
in principle, yes. I don't know what the software stack is, nor what the workflow through the tooling is like. In general, I suspect it is somewhere between a 10 layer PCB and those multilayer ceramic modules the military at least used to use all the time. It isn't like I can fire up Kicad with a plugin for these things...
I doubt if it is cost-effective to do, say 12 units unless it is for a military contract. You probably don't need a volume of millions of units a year for it to make sense. Does it make sense for a thousand units? Ten thousand? For those numbers, that opens a lot of possibilities. And could spell the end of the traditional merchant chip model for servers. Especially if other companies can use Infinity Fabric for their own designs.