| To: donpat who wrote (21) | 4/24/2006 1:22:50 AM | | From: caly | | | | Well, this sheds a little light on things.
sec.gov
The Offering
Securities Offered A total of 32,139,429 shares of our common stock, $0.001 par value per share.
Shares Outstanding As of April 10, 2006, we had 29,609,022 shares of common stock outstanding. This includes 14,649,440 shares held by executive officers and directors of the Company. The shares held by such executive officers are “restricted securities” as that term is defined under Rule 144 under the Securities Act of 1933, as amended, and accordingly are subject to certain restrictions on resale. 1,304,444 of such shares are also subject to vesting requirements. See “Executive Compensation.” Members of management have also executed agreements dated July 11, 2005, which restrict them from selling more than one-twelfth of their shares of common stock per month until July 11, 2006.
The number of outstanding shares set forth above does not include the 32,139,429 shares of common stock offered by the selling stockholders under this prospectus, which shares will be acquired by the selling stockholders upon the conversion of the shares of our Series A Preferred Stock and the exercise of warrants held by the selling shareholders. Up to 31,168,879 of such shares are issuable upon exercise or conversion of currently outstanding warrants and shares of Series A Preferred Stock (based on a conversion rate of 1.08 per share of Series A Preferred Stock) and (ii) 970,550 of which will be issued upon conversion of Series A Preferred Stock to be issued in payment of certain contractual registration rights penalty fees. Of the 31,168,879 shares referred to in (i) above, 1,552,924 of such shares may be issued upon the conversion of Series A Preferred Stock issued as dividends on the outstanding shares of Series A Preferred Stock, rather than being issued upon the conversion of such Series A Preferred Shares. |
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| From: donpat | 4/27/2006 11:49:36 AM | | | | | | GrafTech's AET Subsidiary and Celsia Technologies Sign Sales and Development Contract
Thursday April 27, 8:30 am ET
MIAMI, April 27 /PRNewswire-FirstCall/ -- Celsia Technologies (OTC Bulletin Board: ICUR - News), a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries, today announced that it has expanded the scope of its relationship with Advanced Energy Technology Inc. ("AET"), a leading producer of electronic thermal management solutions under the eGRAF® brand name. AET is a subsidiary of GrafTech International Ltd. (NYSE: GTI - News), one of the world's largest manufacturers of high quality synthetic graphite, natural graphite and carbon-based products.
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Under today's expansion of the companies' relationship, they will begin working to jointly develop next generation thermal solutions based on the combination and integration of AET's and Celsia's current thermal management technologies, including AET's graphite material science and Celsia's micro fluidic thermal management technologies. Jointly developed products will be sold and marketed by AET.
The companies originally announced a letter of intent on November 3, 2005 covering sales and marketing by AET of Celsia's current products utilizing AET's extensive network and capitalizing on the commercial success already achieved by AET in the thermal management market. AET was given exclusive rights to sell and market certain Celsia products for specific market segments.
Hakan Wretsell, Chief Executive Officer of Celsia Technologies, said, "Since signing the letter of intent last November, we have been working diligently on our go to market strategy. We have prioritized our opportunities in order to first pursue key industries and end markets. Both organizations have worked successfully together in this effort, and we are pleased with the progress we have made. The distribution potential of the partnership with AET remains just as important. AET has significant marketing and distribution experience as shown through their rapid commercialization of eGRAF® thermal management products. Through their extensive sales and distribution network, we expect to rapidly commercialize our products in completely new industries, such as the automotive and flat panel display industries."
John Wetula, President of AET, commented, "Our initial collaboration has performed as expected, giving us increased enthusiasm. We continue to view this as an important strategic initiative for AET, given the market potential we believe that arises from adding Celsia's current technologies and products to our portfolio. The partnership allows us to leverage our success with eGraf® products to further our vision of becoming the world's leading thermal solutions provider. We are optimistic that the joint development of next generation thermal management solutions will also create new opportunities in various high-growth market segments and help accelerate the achievement of our aggressive goals."
About Celsia Technologies
Celsia Technologies is a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries. The Company is a leader in developing and commercializing next-generation cooling solutions built on its patents in thermofluid nanotechnology. Celsia Technologies' extensive intellectual property portfolio includes patents registered in Korea, the U.S., Japan and Taiwan, with patents pending in the EU, Russia, India and in China. Celsia Technologies is the brand name of iCurie, Inc. For more information visit: celsiatechnologies.com .
About Advanced Energy Technology Inc.
Advanced Energy Technology Inc., is one of the world's leading manufacturers and providers of high quality natural graphite based products for customers worldwide in the electronics, fuel cell, automotive, power generation, semiconductor, transportation, and petrochemical markets. GRAFCELL®, GRAFOIL®, and eGRAF® are registered trademarks of AET. For more information on Advanced Energy Technology Inc., and its eGraf® products, call 216-529-3777 or visit our website at www.egraf.com. For additional information on our parent, GrafTech International Ltd., call 216-676-2000 or visit our website at graftech.com .
Contacts:
Michael Karpheden David Pasquale / Abbas Qasim
Celsia Technologies The Ruth Group
Phone: (305) 529-6290 Executive Vice President
Phone: 646-536-7006 / 7014
Email: dpasquale@theruthgroup.com /
aqasim@theruthgroup.com
Source: Celsia Technologies |
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| From: donpat | 5/1/2006 6:56:08 PM | | | | | | Nanotubes act as 'thermal velcro' to reduce computer-chip heating
West Lafayette, IN | Posted on May 01, 2006
Engineers have created carpets made of tiny cylinders called carbon nanotubes to enhance the flow of heat at a critical point where computer chips connect to cooling devices called heat sinks, promising to help keep future chips from overheating.
Researchers are trying to develop new types of "thermal interface materials" that conduct heat more efficiently than conventional materials, improving overall performance and helping to meet cooling needs of future chips that will produce more heat than current microprocessors. The materials, which are sandwiched between silicon chips and the metal heat sinks, fill gaps and irregularities between the chip and metal surfaces to enhance heat flow between the two.
Purdue University researchers have made several new thermal interface materials with carbon nanotubes, including a Velcro-like nanocarpet. "The bottom line is the performance that we see with nanotubes is significantly better than comparable state-of-the-art commercial materials," said Timothy Fisher, an associate professor of mechanical engineering who is leading the research. "Carbon nanotubes have excellent heat-conduction properties, and our ability to fabricate them in a controlled manner has been instrumental in realizing this application."
Recent findings have shown that the nanotube-based interfaces can conduct several times more heat than conventional thermal interface materials at the same temperatures. The nanocarpet, called a "carbon nanotube array thermal interface," can be attached to both the chip and heat sink surfaces.
"We say it's like Velcro because it creates an interwoven mesh of fibers when both sides of the interface are coated with nanotubes," Fisher said. "We don't mean that it creates a strong mechanical bond, but the two pieces come together in such a way that they facilitate heat flow, becoming the thermal equivalent of Velcro. In some cases, using a combination of nanotube material and traditional interface materials also shows a strong synergistic effect."
Findings related to the combination of carbon nanotubes and traditional interface materials are detailed in a paper appearing in the May issue of the International Journal of Heat and Mass Transfer. The paper was written by mechanical engineering doctoral student Jun Xu and Fisher.
Heat is generated at various points within the intricate circuitry of computer chips and at locations where chips connect to other parts. As heat flows through conventional thermal interface materials, the temperature rises about 15 degrees Celsius, whereas the nanotube array material causes a rise of about 5 degrees or less.
It will be necessary to find more efficient thermal interface materials in the future because as computer chips become increasingly more compact, more circuitry will be patterned onto a smaller area, producing additional heat. Excess heat reduces the performance of computer chips and can ultimately destroy the delicate circuits.
The nanotubes range in diameter from less than one nanometer to about 100 nanometers. A nanometer is a billionth of a meter, or about the distance of 10 atoms strung together.
The nanotube carpets also might have military and other commercial applications for cooling "power electronics," which are systems that control and convert the flow of electrical power so that it can be used for various purposes on an aircraft, ship or vehicle.
The research has been funded by Purdue's Cooling Technologies Research Center, supported by the National Science Foundation, industry and Purdue to help corporations develop miniature cooling technologies for a wide range of applications, from electronics and computers to telecommunications and advanced aircraft. Applications in power electronics are being supported by the Air Force Research Laboratory in association with the Birck Nanotechnology Center at Purdue's Discovery Park.
The technology is ready for commercialization and is being pursued by several corporate members of the cooling research center, including Nanoconduction Inc., a startup company in Sunnyvale, Calif., which is a new member of the cooling center.
####
Writer: Emil Venere, (765) 494-4709, venere@purdue.edu
Source Timothy Fisher, (765) 494-5627, tsfisher@purdue.edu
Related Web site:
Timothy Fisher: tools.ecn.purdue.edu/ME/Fac_Staff/fisher.whtml
Note to Journalists: An electronic copy of the research paper is available from Emil Venere, (765) 494-4709, venere@purdue.edu
ABSTRACT
Enhancement of thermal interface materials with carbon
Jun Xu, Timothy S. Fisher
This paper describes an experimental study of thermal contact conductance enhancement enabled by carbon nanotube (CNT) arrays synthesized directly on silicon wafers using plasma-enhanced chemical vapor deposition. Testing based on the one-dimensional reference bar method occurred in a high-vacuum environment with radiation shielding, and temperature measurements were made with an infrared camera. Results from other thermal interface materials are presented, as well as combinations of these materials with CNT arrays. Dry CNT arrays produce a minimum thermal interface resistance of 19.8 mm2 K/ W, while the combination of a CNT array and a phase change material produces a minimum resistance of 5.2 mm2 K/W.Text of abstract, with leading set at 14 points, so it doesn't take as much room.
Contact:
Purdue University
News Service
400 Centennial Mall Drive, Rm. 324
West Lafayette, IN 47907-2016
(765) 494-2096
fax: (765) 494-0401
purduenews@purdue.edu
Copyright © Purdue University
nanotech-now.com |
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| To: donpat who wrote (24) | 5/3/2006 3:49:10 PM | | From: caly | | | | Celsia Technologies Announces Contract with Kubo Kinzoku to Expand Sales Presence in Japan
Wednesday May 3, 8:28 am ET
MIAMI, May 3 /PRNewswire-FirstCall/ -- Celsia Technologies (OTC Bulletin Board: ICUR - News), a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries, today announced the expansion of its sales presence into Japan with Kubo Kinzoku Co., Ltd. ("Kubo"), one of Japan's leading commercial sales agents.
Under the terms of the contract, Kubo will serve as Celsia Technologies' commercial sales agent for several different heat management solutions in Japan. Kubo's sales force will educate customers and sell Celsia Technologies' proprietary micro cooling technology to a well-defined selection of electronic companies in the Japanese marketplace. Kubo has agreed to reach specific volume targets for 2006 and 2007. The agreement includes but is not limited to customers of Kubo involved in consumer electronics manufacturing.
Hakan Wretsell, Chief Executive Officer of Celsia Technologies, said, "Japan represents a huge opportunity with its established markets in each of our target industries. Given the high potential of this region it was critical that we had a strong partner with the extensive sales force and customer relationships, along with the impeccable reputation that Kubo has built over time. Celsia is also a great fit because Kubo's team is renowned for introducing breakthrough technologies and has been instrumental in developing the heat management market in Japan. Kubo's existing customers include global leaders Sony, NEC, Sharp, Pioneer and Fujitsu, among others -- all ideal targets for Celsia's thermal management solution."
Kubo Hiroichi, President of Kubo commented, "Celsia is the latest in a long line of technology innovations we have helped establish in the Japanese marketplace. We are excited that we can bring our customers and suppliers a proven, breakthrough technology that can help improve product performance. We are optimistic that this will be a long-term, mutually rewarding relationship for both Kubo and Celsia."
About Celsia Technologies
Celsia Technologies is a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries. The Company is a leader in developing and commercializing next-generation cooling solutions built on its patents in thermofluid nanotechnology. Celsia Technologies' extensive intellectual property portfolio includes patents registered in Korea, the U.S., Japan and Taiwan, with patents pending in the EU, Russia, India and in China. Celsia Technologies is the brand name of iCurie, Inc. For more information visit: celsiatechnologies.com.
About Kubo Kinzoku Co., Ltd.
Kubo Kinzoku is a distributor and a thermal design company, representing worldwide producers of high quality non-ferrous metal materials and thermal solution products. For over 59 years (Est.1946), our mission has been to meet the numerous and high levels of customer demands, through the handling of everything from base metals. Furthermore, we not only supply metal in its raw material form, we are offering original thermal design products for mobile PC, projector, and electronic device and more. Using our global network of professionals, we continue to accumulate ability to meet the demands of our customer, through the rearing of our personnel, the development of new products, and the gathering of useful information. kubo-kinzoku.com |
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| From: donpat | 6/5/2006 4:28:54 PM | | | | | | Lighting Science Group Unveils First Product Containing Celsia Technologies' Two-Phase Cooling Solution
Monday June 5, 2:40 pm ET
R30 Floodlight Uses 80% Less Energy; Lasts 20 Times Longer Than Comparable Incandescent Bulb
MIAMI and DALLAS, June 5 /PRNewswire-FirstCall/ -- Celsia Technologies (OTC Bulletin Board: ICUR - News), a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries, and Lighting Science Group Corporation (OTC Bulletin Board: LSGP - News), a leading designer and marketer of super energy efficient LED lighting solutions based on its proprietary Optimized Digital Lighting(TM) (ODL®) technology, announced the availability of Lighting Science's LED R30 floodlight in cool white color, which contains Celsia's two- phase heat transfer technology. Lighting Science's latest innovative product was unveiled at Lightfair International 2006 in Las Vegas on May 31, which was attended by leading designers, manufacturers and customers of the lighting industry.
Lighting Science's LED R30 floodlight in cool white color provides the equivalent light output of a 60-65 watt incandescent bulb but uses 80% less energy over a lifetime that is up to 20 times longer. The LED R30 floodlight, which is dimmable produces 425 lumens while consuming only 10.5 watts and has a 50,000-hour life. The new floodlight, powered by Optimized Digital Lighting(TM) (ODL®) technology, is designed for both indoor and outdoor applications, and can be used in recessed cans and other fixtures that require a standard screw base reflector light bulb. The R30 floodlight is one of the most widely used bulbs today, typically found in large quantities in commercial, industrial, retail, educational and hospitality facilities. The cool white LED R30 is the first product to be marketed under the recently announced sales and development agreement between Celsia and Lighting Science.
Hakan Wretsell, Chief Executive Officer of Celsia Technologies, said, "The numbers speak for themselves. With our partner, Lighting Science Group, we are bringing to market the next generation in powerful, heat and energy efficient, long lifecycle lighting solutions. The commercial, industrial, retail, educational and hospitality applications are numerous and far reaching globally. Our technology goes through rigorous reliability testing, to ensure product performance and customer satisfaction. Given that this new bulb has a 50,000-hour life expectancy -- 20 times the normal incandescent bulb life -- our heat dissipation technology is instrumental. This is another very important milestone in our path to commercialization, and we expect many exciting products to be launched through this strategic partnership."
Ron Lusk, Chairman and Chief Executive Officer of Lighting Science Group Corporation, commented, "Lighting Science is very pleased to introduce another important product to the market. The LED R30 floodlight is substantially more cost efficient, more energy efficient and longer lasting than comparable incandescent offerings on the market today. Celsia's innovative and flexible cooling solution was built into our existing product designs with relative ease, and we are pleased with the results of the various reliability and performance tests we performed prior to unveiling the product at Lightfair International. We are optimistic about our sales and development agreement with Celsia, as it allows us to further enhance our product offering in a practical and cost efficient manner."
About Celsia Technologies
Celsia Technologies is a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries. The Company is a leader in developing and commercializing next-generation cooling solutions built on its patents in thermofluid nanotechnology. Celsia Technologies' extensive intellectual property portfolio includes patents registered in Korea, the U.S., Japan and Taiwan, with patents pending in the EU, Russia, India and in China. Celsia Technologies is the brand name of iCurie, Inc. For more information visit: celsiatechnologies.com .
About Lighting Science Group Corporation
Lighting Science Group Corporation ( lsgc.com ) designs and sells highly energy efficient and environmentally friendly lighting solutions based on its proprietary Optimized Digital Lighting(TM) (ODL®) technology. The Company's patented and patent-pending designs and manufacturing processes enable affordable, efficient and long lasting LED based lighting systems to be quickly deployed in existing lighting applications and produce immediate cost savings and environmental benefits. Products include low bay fixtures for parking garages and industrial facilities, MR-16, R30, R25, G11, G25, candelabra and flame tip bulbs which can be purchased at store.lsgc.com .
"Lighting Science," "Optimized Digital Lighting" and "ODL" are trademarks of Lighting Science Group Corporation.
Contacts:
Michael Karpheden David Pasquale / Abbas Qasim
Celsia Technologies The Ruth Group
Phone: (305) 529-6290 Executive Vice President
Phone: 646-536-7006 / 7014
Email: dpasquale@theruthgroup.com /
aqasim@theruthgroup.com
Ron Lusk, Chairman/CEO The Equity Group Inc.
Lighting Science Group Loren G. Mortman
214-382-3630 212-836-9604
Lauren Till
212-836-9610
LTill@equityny.com
--------------------------------------------------------------------------------
Source: Celsia Technologies |
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| To: caly who wrote (25) | 10/2/2006 9:16:01 AM | | From: caly | | | | Celsia Technologies' New MicroSpreaders Cool the Rising Heat Wave in Electronic Devices
Monday October 2, 8:00 am ET
Industry's Thinnest and Lightest Thermal Management Products Can Scale to Fit Miniature LED Lights to Large CPUs
MIAMI, Fla., Oct. 2 /PRNewswire-FirstCall/ -- Celsia Technologies (OTC Bulletin Board: ICUR - News) today announced the availability of its MicroSpreader(TM) line of thermal management products equipped with an optimal cooling design for all types of systems and devices. MicroSpreaders, the thinnest and lightest two phase heat spreaders in the industry, are built on Celsia's patented micro thermofluidic design. They are flexible to easily integrate with any electronic device and minimize the required space for cooling. In addition to being thinner and lighter, the MicroSpreaders deliver significantly higher thermal conductivity (heat transfer capacity) versus conventional options such as aluminum, copper, heat pipes and other metal materials used for cooling.
"As a manufacturer and provider of thermal management components and accessories for the electronics industry, we are always looking for the best new innovative solutions to offer to our customers," said Gary Kuzmin, director of ThermaFlo. "We are integrating the Celsia MicroSpreaders into a total solution for telecom base stations and LED lighting applications. The solution, including the high-performance MicroSpreaders, will meet the highest quality standards."
With thermal conductivity of more than 5,000 watt per meter Kelvin (w/m K), MicroSpreaders have a heat transfer capacity 25 times greater than aluminum and 13 times greater than copper, the two most commonly used metal heat conductors. In a given application, MicroSpreaders can increase the cooling system's performance by 25 to 60 percent over other industry solutions. In the area of LED lighting, tests have shown that MicroSpreaders can improve the life of devices by 10-15x.
"The electronics industry needs effective, compact, inexpensive and innovative cooling solutions to keep pace with increasingly small and mobile electronic devices," said George Meyer, Celsia's chief marketing officer and general manager of the Americas and Europe. "What we've done at Celsia is leverage micro thermofluidic technology to create an innovative, cost-effective solution for products across the electronics supply chain. Implications range from increasing the processor speed in a computer or cutting lighting energy costs by an order of magnitude."
Measuring at 1.4mm thick and weighing only 25 grams, the spreaders boast a 28 percent reduction in thickness and 33 percent reduction in weight over competitive products. The razor thin plates or tubes can be built to fit a variety of small and large devices. With no mechanical parts, the MicroSpreaders are noise and vibration free, eliminating the need to reconfigure product design to accommodate the cooling device. Within the plate or tube is an extensive network of micro channels through which pure water moves rapidly, changing from water to vapor and back to water, removing excess heat. The MicroSpreaders can be attached directly to the heat source to enhance cooling capability.
Pricing and Availability
Celsia's MicroSpreaders are shipping now worldwide through Celsia's strategic partnerships. Pricing starts at less than $10.00 (USD) per unit. For more detailed product information or to request a quote, visit www.celsiatechnologies.com, call 1-305-529-6290 or email info@celsiatechnologies.
About Celsia Technologies
Celsia Technologies is a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries. The company is a leader in developing and commercializing next-generation cooling solutions built on patented micro thermofluidic technology. Celsia Technologies' extensive intellectual property portfolio includes patents registered in Korea, the U.S., Japan and Taiwan, with patents pending in the EU, Russia, India and in China. Celsia Technologies is the brand name of iCurie, Inc. For more information visit: celsiatechnologies.com /. |
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| To: caly who wrote (27) | 10/2/2006 9:48:57 AM | | From: donpat | | | | Here I sit at my computer keyboard....what is that constant noise that envelops me? Oh - the computer FANS!!! Two FANS!!! NOISY FANS!!!!!
Celsia to the rescue.....ahhhhhhhh.....QUIET!!!! |
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| To: donpat who wrote (28) | 11/16/2006 9:10:45 AM | | From: caly | | | | Celsia Technologies Cools off Scorching Hot Graphics Cards With New High Performance Cooling Solution - Introducing the Iceon(TM) 1000CG
Thursday November 16, 8:00 am ET
Company Receives Largest Order To-Date From Leading Graphics Board Manufacturer
MIAMI, Nov. 16 /PRNewswire-FirstCall/ -- Celsia Technologies (OTC Bulletin Board: CSAT - News) today introduced the industry's first graphics card cooling product with a patented micro thermofluidic core to enhance cooling system performance. The new Iceon(TM) 1000CG offers manufacturers of graphics cards, boards and PCs unmatched performance, quiet operation and cost efficient design with a smaller profile than other products on the market.
"With ever increasing demand for more speed and performance in graphics cards, the industry needs better and more efficient cooling solutions to keep pace," said Raman Monga, industry manager, SMT & Electronic Components, Frost & Sullivan. "Current industry solutions are becoming impractical in terms of size and noise, causing manufacturers to make performance tradeoff decisions. Celsia's cooling solutions have a high heat transfer rate and offer the performance needed for the most demanding applications."
Representing Celsia's largest product purchase contract to-date, Daesan IT Co. Ltd. ( www.daesanit.co.kr ), a leading distributor of graphics card boards, signed a contract to be the exclusive buyer in the Korean market of the new Iceon 1000CG graphics cooler. The contract is anticipated to amount to approximately $500,000 in revenue for Celsia over the next six months. Daesan IT will incorporate the Iceon 1000CG into its graphics card boards for its customers in the high-performance market, including computer, design and graphics professionals and gaming enthusiasts.
"Our computer graphics boards include the most cutting edge technology for the highest performance available," said Mr. Chris Choi, CEO of Daesan IT. "Because Celsia's Iceon 1000CG maintains very low temperatures and operates with basically no noise, it is the best cooling solution for our needs. We have never seen a customized product come from the drawing board more quickly. Celsia provided the product design in record time. From a technology and business perspective, Celsia is providing us with a strong competitive differentiator."
"Our entry into perhaps the fastest growing segment of the semiconductor industry is the latest in a number of targeted market entries," said Hakan Wretsell, CEO of Celsia Technologies. "We are very well positioned to capitalize on the growing demand for new, high performance cooling products. To date, sales for the fourth quarter have exceeded sales of the third quarter. The order from Daesan IT continues our robust growth in sales and orders, and positions us for a very strong start to 2007. The graphics card market is a very important component in our business projections for 2007 and beyond. Daesan IT is the best possible partner for us as we enter this market. The company's market position and product offerings make this one of our strongest partnerships."
The Celsia Iceon 1000CG graphics cooler includes a powerful fan packaged with the industry's thinnest and lightest heat spreader technology, Celsia's NanoSpreader(TM). With a vast network of micro channels that increase heat transfer capacity to 25 times greater than aluminum and 13 times greater than copper, NanoSpreaders maximize cooling capability by 25 to 60 percent over other solutions. The technology enables slower fan speeds to increase fan life and decrease noise. The Iceon 1000CG has an excellent noise-to-performance ratio, enabling it to provide quiet operation under the most extreme circumstances.
Pricing and Availability
Celsia's Iceon 1000CG graphics coolers will be available for shipment to selected markets in the fourth quarter of 2006, and will be rolled out globally in 2007. Distribution pricing starts at less than $10 (U.S.) per unit. For more detailed product information or to request a quote, visit www.celsiatechnologies.com, call 1-305-529-6290 or email info@celsiatechnologies.com.
About Celsia's NanoSpreader Technology
Celsia's NanoSpreaders are the thinnest and lightest two-phase heat spreaders in the industry. Built on Celsia's patented micro thermofluidic design, the razor-thin plates or tubes are flexible to easily integrate with any electronic device and minimize the required space for cooling. Within each plate or tube is an extensive network of micro channels through which pure water moves rapidly, changing from water to vapor and back to water, removing excess heat. The NanoSpreader technology delivers significantly higher thermal conductivity (heat transfer capacity) than conventional options such as aluminum, copper, heat pipes and other metal materials used for cooling. NanoSpreaders can be attached directly to a heat source to enhance cooling capability. With no mechanical parts, they are noise and vibration free.
About Celsia Technologies
Celsia Technologies is a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries. The company is a leader in developing and commercializing next-generation cooling solutions built on patented micro thermofluidic technology. Celsia Technologies' extensive intellectual property portfolio includes patents registered in Korea, the U.S., Japan and Taiwan, with patents pending in the EU, Russia, India and in China. For more information visit: www.celsiatechnologies.com. |
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| From: donpat | 12/18/2006 8:34:34 AM | | | | | | Electricity-saving nano startup moves to UK/JH Lee/iCurie/AirNatech
By Andrew Murray-Watson
The Independent on Sunday
Dec. 18, 2006 -- A start-up nanotech company, which has secured $250 million in funding commitments and promises to significantly cut the world's energy usage, is to set up its global headquarters in the UK.
AirNatech, which has developed a technology to cut electricity usage in heating, ventilation and air conditioning units by at least 50 per cent, is establishing itself in Cambridge.
The company's backers claim that AirNatech could have a market capitalization of more than $1 billion by the end of next year and will create more than 100 high-skilled jobs in the UK. AirNatech was created from the merger of UK-based Air-Nacon and NIL Technology of Denmark and is backed by Bridgehead Group, a U.S. boutique investment bank.
The company decided to move to the UK after meetings with officials from the UK Trade and Investment's Global Entrepreneur Program, a body set up by the government to attract hi-tech companies to the country.
AirNatech's nanotechnology works by making heat exchangers, such as those found in air conditioning units, significantly more efficient. The company claims that its specially engineered copper is 40 times more effective at transferring heat than conventional materials.
The technology was originally created by J. H. Lee, a former NASA scientist who helped develop the powerless cooling technology in the U.S. space shuttle.
Eric van der Kleij, the British government's senior global deal-maker, said: "We believe that emerging technologies that work towards conserving energy should be supported by government. The harnessing of these complementary technologies which are being acquired by Air-Natech will act as a catalyst towards commercialization."
(c) 2006 The Independent on Sunday. via ProQuest Information and Learning Company. All Rights Reserved.
smalltimes.com
******************************************
BACKGROUND
Revolutionary nano-scale super-cooling technology to get global rollout from UK
This was published: 2004-04-16 11:00:00
A former NASA scientist and his team will bring their revolutionary new nano-scale, super-cooling technology to the world - from a UK base.
The patented, environment-friendly system is expected to have a major global impact on a range of everyday applications - ranging from air conditioning to increasing computer speeds.
After award-winning work on two space shuttle missions with NASA, former Samsung scientist Dr Jeong Hyun Lee created and patented the breakthrough cooling technology - initially to address the development-hindering problem of semiconductor cooling. The radical cooling technology is unique in that it does not require fans, pumps, dangerous gases or electricity to be effective. The system has been initially applied to semiconductor cooling in overcoming one of the biggest barriers in developing faster computer speeds - heat. However Dr Lee and his team believe the technology could eventually reduce the size and running cost of air conditioning by around 70%.
In a landmark deal that was assisted by UK Trade & Investment, iCurie Lab Holdings Ltd. has attracted significant series A investment from specialist US Emerging-Technology finance organisation Hansen Gray & Company Inc. (OTC: HGCI), to establish the worldwide headquarters in the UK. The new company also hopes to create hundreds of new jobs in the UK nanotechnology sector.
Curie's CEO, Dr J H Lee said: "The world has only recently started to understand the true impact of current cooling methods which can often consume a significant amount of energy or use chemicals which could endanger the environment. We wanted to provide our solution to the problem as efficiently as possible from a global-rollout perspective. We found that the UK offers the ideal financial, technical and corporate environment from which to grow a major global business."
Mark E Gray, Chief Executive of Hansen Gray & Company Inc, said: "We could not be more pleased to have completed the iCurie agreement, and our special thanks goes to the British Government's Global Entrepreneur Programme and their crucial support. We believe in world-class management teams, as well as businesses with the potential for sustainable growth based on quality and innovation in the value chain, versus ones that compete solely on price. We were very impressed with Dr Lee and iCurie's underlying innovations which embody all of these qualities, when properly supported in the right funding and development environment."
William Pedder, head of UKTI's Inward Investment team said: "This important agreement represents a double-win for the UK, by attracting both word class scientists and intellectual property in iCurie Labs, as well as significant inward-investment finance from Hansen Gray & Company to the UK. We are delighted that the strengths of the UK have once again been recognised as one of the most favourable locations in the world for a establishing disruptive, knowledge-based global business."
iCurie and Hansen Gray were provided with assistance and resources of UKTI's Global Entrepreneur Programme, crucial information on key strategic funding sources, as well as professional advice from PricewaterhouseCoopers on the most efficient corporate structure to create, protect, and develop a new major global business.
Background information on this article:
UK Trade & Investment is the government organisation that provides integrated support services for UK companies engaged in overseas trade and foreign businesses focused on the UK as an inward investment location. It brings together the work of teams in 200 British embassies and FCO posts overseas and government departments across Whitehall. In England, UK Trade & Investment services are delivered through the 45 Business Links and other partners including Regional Development Agencies and Chambers of Commerce, coordinated by nine regional International Trade Directors. The devolved administrations in Scotland, Wales and Northern Ireland have their own arrangements for local delivery of services. UK Trade & Investment's work ensures UK and overseas companies benefit from the organisation's continuing commitment to provide an integrated service, delivering business opportunities through a global network. For more information visit the web site www.uktradeinvest.gov.uk
The UK Global Entrepreneur Programme is a specialist team created within UK Trade & Investment. Comprised of successful entrepreneurs and venture capitalists known as "Dealmakers", the team use their extensive networks and experience to identify and attract the highest calibre flow of "People and Ideas of Exceptional Potential" to the UK.
publictechnology.net
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AirNatech Holdings Ltd. Establishes in the UK a Major Environmental Nanotechnology Win for UK Trade and Investment
Monday November 6, 8:15 am ET
UKTI's Global Entrepreneur Program and US Bridgehead Group collaborate to create AirNatech Holdings Ltd. in the UK, immediately securing a seven figure investment in NIL Technologies of Denmark. This move marks phase two of the group's global strategy of becoming a worldwide leader in ultra-efficient Nano-technology powered refrigeration, renewables, and related industries such as solar and fuel cells.
LONDON and NEW YORK, Nov. 6 /PRNewswire/ -- Bridgehead Group (http://www.bhgltd.com ), the international business strategy, venture capital and investment banking organization based in New York City, has recently acquired a major stake in NIL Technology ApS, a Danish Nanotechnology company which pioneered Electron-lithography techniques for reliably creating nanostructures & imprint services -- much needed to develop the next generation of ultra energy-efficient refrigeration and computing technologies. The move follows Bridgehead's financing in February 2006 of AirNacon Ltd., which will also become a subsidiary of AirNatech Holdings Ltd. With the assistance of UK Trade & Investment's (UKTI) Global Entrepreneurs Programme (GEP), Bridgehead Group now has organized its operations including AirNacon Ltd. and NIL Technologies within a single UK-based holding company called AirNatech Holdings Ltd.
London based AirNatech will finance, structure, control and grow its global operations in the air conditioning, refrigeration, and related nano-technology industries. AirNatech and its partners provide companies and technologies with excellent growth potential and a holistic support system that enables synergy between the companies, traction with strategic partners, employee participation, exit strategies, and access to innovation coupled with protection of intellectual property at early stages. The principal objective of the group is to facilitate but professionally manage billion-dollar industry super-growth, by deploying experienced management together with extraordinary industry innovation.
The UKTI GEP helped Bridgehead Group in many aspects of planning, structuring and financing for AirNatech to become a British headquartered company. GEP Dealmaker Eric Van der Kleij aided Bridgehead by providing key information about the benefits of a UK holding structure. Bridgehead's relationship with Mr. Van der Kleij began around three years ago when he helped Bridgehead's CEO Jeppe Hansen acquire a stake in iCurie, now Celsia Inc. The GEP will continue to assist the AirNatech team as it executes the next phases of its $250M financing and commercial growth plans.
UKTI created the GEP to attract talent, finance, and take advantage of the unique strategic benefits of the UK as a global headquarters for major new businesses. The GEP utilizes a network of proven successful entrepreneurs or "Dealmakers," such as Eric Van der Kleij, who provide information and guidance on every aspect of setting up a new venture in the UK. "We are very pleased to have helped Bridgehead form a cohesive and pioneering global technology group that that will create substantial value for all the components by capitalizing on the synergies between them," said Derek Goodwin, Head of Global Entrepreneurs Programme. "We believe that emerging technologies, especially those that are working towards advanced ways to conserve energy, should be supported by governments. They are a crucial part of the future that we are pleased to be supporting."
Mr. van der Kleij commented, "I have enjoyed working with Bridgehead at every stage of the process. They are an exciting organisation, always at the forefront of technological and commercial innovation. The recent creation of AirNatech proves once again that their sophisticated and effective mentorship of global entrepreneurial innovation is instrumental in helping a start-up company to become a global success in its field."
Mr. Jeppe Hansen, Chairman of AirNatech and Chief Executive Officer of Bridgehead remarked, "Bridgehead is extremely grateful for the support of UKTI. They have consistently provided us with exemplary assistance and guidance, and their support and experience enables us to gain far more commercial and investment traction than a purely private company. Basing this global group in London will provide numerous advantages that other countries cannot offer, such as a superior strategic global reach and more favorable protection of the group's intellectual property."
About The Global Entrepreneurs Programme
UK Trade & Investment launched the Global Entrepreneurs Programme (GEP) in 2003 as a new approach to economic development. The GEP champions new business ideas by bringing together entrepreneurs and those who can best guide them towards success in the UK. Experienced Dealmakers act as a liaison between the government and entrepreneurs. For more information visit the GEP website at entrepreneurs.gov.uk .
UK Trade & Investment is the government organization that provides integrated support services for UK companies engaged in overseas trade, and foreign businesses focused on the UK as an inward investment location. For more information visit the web site at uktradeinvest.gov.uk .
About NIL Technologies
NIL Technology ApS is a nanotechnology company pioneering electron lithography to deliver consistent quality nano-imprint services and stamps required to unlock the next generation of refrigeration, fuel cell, microprocessor, and optical equipment. nilt.com
About Bridgehead Group
Integrating the key components of capital creation and business management into a seamless system is the cutting edge concept of Bridgehead Group. The Bridgehead Group Business System combines industry leading strategic partners, investment funds and business management into a powerful new strategy that minimizes risk, increases speed to market and maximizes return for breakthrough ventures across the globe. bhgltd.com
airnatech.com |
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| From: donpat | 3/21/2007 8:15:39 AM | | | | | | Using steam to cool computers
By Michael Kanellos, CNET News.com
Wednesday, March 21 2007 11:35 AM
You can hold Celsia's new cooling component for about three seconds. Then your fingers start to feel as if they're getting burned.
It's part of a new line of components from the San Jose, Calif.-based company that it says will cool off torrid hotspots inside computers and light fixtures running light emitting diodes (LEDs) better than conventional heat pipes or fans.
Feeling is believing. In the corporate demonstration, a person stirs a cup of hot water with a stick of copper. It takes about five seconds or so to feel a gradual warming sensation. The human guinea pig then stirs with one of the company's heat spreaders: the rapid rise in temperature is noticeable before two seconds elapse. Holding the NanoSpreader for five seconds is nearly impossible.
The sudden rush of heat occurs because steam is being created inside the NanoSpreader, said George Meyer, director of development at the company, which was re-launched in 2006. The exterior of the device is a copper sleeve that absorbs heat from a processor or a hard drive.
The interior consists of a series of vacuum-sealed chambers and channels containing small amounts of water. The water turns to steam, which then conducts the heat from the source to another component, such as an aluminum heat sink, that can dissipate the heat into the ambient atmosphere.
"Steam conducts heat better than almost any substance out there," he said.
Testers often don't believe that. "There's got to be some sort of chemical in there," one observer said, though Meyer affirmed that the active ingredients are copper and water.
Heat is one of the primary obstacles for industrial designers and consumer electronics manufacturers these days. Consumers want small, quiet devices. Unfortunately, components like processors and hard drives generate a lot of heat and often require fans or heat pipes, tubes of metal that conduct heat away, to keep them cool.
"The digital video recorder is one of the most strenuous applications for a hard drive there is," said Meyer. Blade server manufacturers and makers of telecommunications equipment are also shopping for new components to remove heat.
The company is also targeting LED lights. Although LEDs can produce a significant amount of light per watt of power, LEDs also generate a significant amount of heat. Thus, LED arrays often need cooling components.
IBM and other companies have created water or oil-filled components for cooling internal computer components for years. But many of these devices contained relatively large amounts of water and are therefore physically large.
Shrinking the size of these components so they won't add bulk in smaller computers has been a bit of a challenge. Cooligy has developed a liquid cooling system, but it requires a mechanical pump. Other companies working on products in this market include Nanocoolers and Cool Chips. None of these companies has experienced broad adoption yet.
For its part, Celsia asserts that it has an advantage in that its components are fairly small, measuring only a few millimeters thick, and are made out of fairly basic materials. It has also teamed up with Taiwan's Yeh-Chiang Technology, one of the largest manufacturers of heat pipes.
Getting this far hasn't been easy. The company emerged from South Korea as iCurie in 2001. In 2005, a new management team was installed and an additional US$20 million in funding was raised from various sources.
Celsia's components cost more than ordinary heat pipes or cooling technologies, but fewer cooling components are needed. In the end, the company says using its components versus ordinary ones should be cost-neutral.
The smaller number of components also frees up designers.
"If you are looking at an ultralight portable, you could build it without a fan," he said.
zdnetasia.com |
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