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Original Articles by SemiVision Research ( Foxconn Research Institute/Samba Photonics Lab/Suruga Seiki Co., Ltd./ Scientech Corporation/ Manz/ KLA Corporation)
Taiwan’s semiconductor industry is currently forming a new semiconductor alliance, driven primarily by the rapid advancements in advanced packaging technologies. These innovations have opened the door for many companies to enter what was traditionally a high-barrier industry, particularly through heterogeneous integration and system-level packaging.
2025/04/15 - The recent semiconductor forum, co-hosted by National Taiwan University of Science and Technology and organization: SIW International, KLA and Teeia showcased how several powerful and well-resourced companies are now stepping into the semiconductor domain. SemiVision Research was also invited to participate in this important event to provide in-depth analysis and insights.
The opening keynote was delivered by the Foxconn Research Institute, focusing on Foxconn’s long-term strategic layout in the semiconductor sector. As previously reported by SemiVision Research, Foxconn is actively investing in silicon photonics, targeting several key technologies such as nano photonics, nano-optics, and high-speed silicon photonics transmission—critical for enabling AI cluster architectures that scale both vertically (scale-up) and horizontally (scale-out). These technologies are increasingly essential as the industry faces several major AI chip design challenges.
One of the most pressing challenges is the “memory wall” problem. As computation speeds outpace data transfer capabilities, companies like SK Hynix, Micron, and Samsung are racing to increase the number of HBM (High Bandwidth Memory) layers. However, this creates additional complexity, especially around the need to enhance the base die of HBM. TSMC Chairman C.C. Wei highlighted this during the 2024 earnings call, noting that HBM controllers are now being designed using 12nm and 5nm nodes to support future scaling
Returning to the core topic—why Foxconn’s research division is playing such a pivotal role—the answer lies in evolving customer demands. As chip architectures continue to grow in complexity and size, physical limits such as reticle size and CoWoS interposer dimensions present hard constraints.
Eventually, conventional copper interconnects face signal integrity and power efficiency limitations at scale. This is where optical interconnect technology becomes essential. Foxconn’s Research Institute is actively investing in this area, recognizing its potential to overcome bandwidth bottlenecks in large AI systems.
The Institute also introduced the concept of meta-lens technology during the forum, a highly promising optical innovation. Meta-lenses use sub-wavelength nanostructures to manipulate light wavefronts with high precision and ultra-compact form factors, offering breakthrough advantages for future automotive LiDAR systems, AR displays, and next-generation sensing modules. SemiVision Research will continue to explore and report on meta-lens technologies and their potential impact.
Notably, Foxconn Research Institute also discussed its exploration into quantum computing, one of the most complex and transformative emerging technologies. Quantum computing operates on principles fundamentally different from classical mechanics—such as quantum superposition and entanglement—and introduces a new computing paradigm centered around qubits. This move signals Foxconn’s ambition to not only lead in advanced packaging and optical interconnects but to invest in the long-term future of computation at the quantum level.
This forum clearly illustrates that Taiwan’s semiconductor industry is entering a phase of structural transformation and platform redefinition. From materials and packaging to optics, memory, and quantum technologies, the value chain is gradually converging and integrating upward. The newly forming industrial alliances aim to connect these key technology nodes and enable a broader range of companies to co-develop the next wave of innovation and competitiveness. SemiVision Research will continue to monitor and report on these developments at the forefront of the industry.
Taiwan is rapidly accelerating its strategic layout in silicon photonics and advanced packaging. This momentum is clearly reflected in the latest research led by the Foxconn Research Institute and National Yang Ming Chiao Tung University (NYCU). According to the technical briefings revealed at the recent semiconductor forum, Taiwanese teams are vigorously advancing the development of a Silicon Photonics (SiPh) platform, aiming to construct a 3.2 Tbps Co-Packaged Optics (CPO) module that will significantly enhance interconnect efficiency and energy performance in AI and high-performance computing (HPC) architectures.
The SiPh project, as outlined in the first presentation, focuses on three main pillars: Free-Space Optical Communication, a 3.2 Tbps ring-resonator-based SiPh transceiver, and a metasurface-on-SiPh platform for ion trap quantum computing. In the area of free-space optical communication, the team has integrated research capabilities from NYCU, TSRI, imec, amf, NICT, KAUST, and Taiwan’s National Science and Technology Council (NSTC). The project aims to build a high-output laser system with wide field-of-view modular continuous-wave sources (MWCW), along with a highly integrated SiPh chip platform that supports high-speed transmission and large-scale module integration.
For the ring-based SiPh transceiver, the team showcased transmitter and receiver chips designed with high-Q ring resonators, demonstrating strong frequency responses at wavelengths such as 1310nm and 1550nm. These designs exhibit excellent signal bandwidth and distortion control, making them highly suitable for large-scale, low-latency data transmission within data centers. Moreover, the application of SiPh technology is being extended into quantum computing, with the development of a metasurface-enabled light-field control platform to support ion trap quantum logic operations. In collaboration with imec and Ion Trap Lab, the team has achieved multi-focus beam shaping and wavefront engineering, reflecting Taiwan’s growing strength in quantum photonic interfaces.
Foxconn Research Institute provides a deeper look into the 3.2 Tbps CPO module architecture. At its core is a high-density module integrating SiPh transceivers, multiple Distributed Feedback (DFB) lasers, Ge photodetectors, and optical output interfaces, interconnected with CPUs, GPUs, or NPUs via an interposer for high-speed data exchange. The module comprises four key technological components: high-efficiency optical couplers utilizing silicon tapers and fiber arrays to minimize loss; high-speed Ge-on-Si photodetectors with dual metal contacts and broad bandwidth response; ring resonator-based modulators optimized for low power and compact size; and DFB lasers using multi-layer InP/InGaAsP heterostructures for long-distance transmission and multi-wavelength operation.
This CPO platform demonstrates complete heterogeneous integration capabilities, supporting co-packaged electrical and optical components and aligning with the future direction .The presentations not only highlight Taiwan’s advanced research capabilities in chip interconnects and packaging design, but also reveal how Foxconn, NYCU, and the domestic research ecosystem are steadily moving toward the localization of high-end SiPh components and system-level integration platforms. These efforts will become crucial technical milestones and enablers of international collaboration in the coming era of AI infrastructure scaling, datacenter energy reduction, and next-generation high-speed communication standards. SemiVision Research will continue monitoring the commercialization progress of this platform and the adoption of CPO modules in AI systems, providing insights into its potential impact on the global semiconductor value chain and the evolving landscape of industrial competition.
Foxconn has been actively investing in cutting-edge silicon photonics technologies, particularly in the area of “Meta on SiPh,” where metasurfaces are integrated directly onto silicon photonics platforms. Originating from pioneering research conducted by renowned U.S. laboratories, this concept has now been successfully internalized by the Foxconn Research Institute. As presented in their recent technical talk, the institute is developing a novel architecture based on ion trapper technology, applying it to “Metasurfaces as a Free-Space Beam Emitter on Silicon Photonics”—a groundbreaking approach that enables precise ion manipulation using integrated photonics, paving the way for quantum computing applications.
In the domain of ion-trap quantum computing, one of the core technical challenges lies in accurately controlling the position and state of individual ions. Traditional systems rely heavily on bulky and complex free-space optical setups, which not only hinder system scalability and integration but also make large-scale manufacturing and deployment difficult. Foxconn’s innovative solution leverages metasurfaces fabricated directly on the output of SiPh waveguides, enabling full control over the phase, amplitude, direction, and focus of light beams in free space, all from a compact, on-chip platform.
This approach significantly reduces the dependency on external optical components and allows for enhanced system compactness, stability, and scalability. Recent demonstrations have shown that metasurface-enhanced SiPh chips can achieve precise beam shaping in free space, including functions such as beam focusing, multi-focus generation, and even holographic projection. These capabilities are critical for key quantum computing tasks such as qubit initialization, gate operations, entanglement generation, and state readout.
Moreover, the integration strategy is fully compatible with standard CMOS fabrication processes, meaning that these advanced quantum photonic devices can be mass-produced using existing semiconductor infrastructure. This dramatically increases the commercial viability of quantum photonics and brings quantum computing closer to real-world, scalable deployment.
Foxconn’s strategic push in this field reflects a broader transformation—from traditional hardware manufacturing to becoming a key enabler in next-generation technologies that fuse nanophotonics, silicon photonics, and quantum information science. This initiative not only redefines how future quantum computing elements are built but also positions Taiwan to play a more central role in the global quantum technology ecosystem.
Metasurfaces and Silicon Photonics: Enabling Scalable and Miniaturized Quantum Computing Systems
As quantum technologies advance at an accelerating pace, the challenge lies in building efficient, stable, and manufacturable quantum computing systems. The integration of metasurfaces and silicon photonics is now seen as a key technological synergy, enabling the miniaturization and system-level integration of complex quantum architectures. This combination offers significant advantages in improving the controllability, scalability, and environmental efficiency of quantum systems.
Subwavelength Structures: The Optical Power of Metasurfaces
Metasurfaces are artificial optical materials composed of subwavelength nanostructures that can precisely control the amplitude, phase, and polarization of light within an ultrathin interface. These features allow conventional optical components—such as lenses, waveguides, and gratings—to be dramatically miniaturized and integrated at the chip level.
In quantum computing, where laser precision is essential for ion control, photon operations, and qubit initialization/readout, metasurface design enables compact on-chip beam focusing, steering, and multi-beam scanning, unlocking unprecedented degrees of freedom for quantum chip architectures.
Silicon Photonics: The Ideal Platform for Quantum Integration
Silicon photonics, due to its compatibility with mature CMOS manufacturing, enables mass production of optoelectronic-integrated chips and is increasingly embraced in quantum computing. When integrated with metasurfaces, silicon photonic chips can host both the optical control components and quantum logic elements such as ion trap arrays, photonic interferometers, and single-photon detectors (e.g., APDs).
For instance, Foxconn’s research team demonstrated metasurface lenses on SiPh chips that focus multiple laser beams for two-dimensional scanning, enabling ion positioning into patterns like the letter “H.” This proves that qubits can be independently manipulated and prepared for array-based parallel operations—a key for multi-qubit quantum computing.
Shrinking Environmental Control Requirements
Quantum computers rely heavily on ultra-high vacuum (UHV) or cryogenic environments to function reliably. These systems are traditionally large, energy-intensive, and costly to maintain.
By miniaturizing and integrating optical systems using metasurfaces and silicon photonics, the overall quantum device footprint—and thus the required controlled environment—is significantly reduced. This allows for smaller vacuum chambers, more compact cryostats, and ultimately lowers system complexity and operational cost—critical for commercial viability.
Toward Practical and Scalable Quantum Systems
An increasing number of research efforts are now focused on building manufacturable quantum components and modules. Photon modulators, single-photon detectors, low-loss waveguides, and entangled photon generators can all be chip-integrated using SiPh and metasurface technologies. Compared to instrument-centric legacy systems, this approach offers higher engineering robustness and commercial scalability.
Furthermore, Taiwan’s government-led “Quantum National Team” program—which includes trapped-ion and optical quantum computing routes—provides a strong policy and funding foundation for advancing SiPh-based quantum technologies within the local ecosystem.
At the core of advanced optical control, metasurfaces inject next-level light manipulation capabilities into silicon photonic platforms. Their integration is crucial for achieving the miniaturization, stability, and scalability goals of future quantum computing systems.
As global competition in quantum innovation intensifies, those who master precision nanofabrication and optoelectronic integration will gain a strategic edge in defining the next era of computing sovereignty. In this quantum revolution, whoever builds the first mass-producible, integrated quantum systems will shape the architecture of tomorrow’s computing world
SemiVision Research will continue to track Foxconn’s developments in Meta on SiPh and silicon-photonic-based quantum platforms, with detailed analysis on its packaging integration, testing strategies, and commercialization prospects.
SemiVision Research will conduct a comprehensive analysis of the Foxconn Research Institute’s technological advancements in the near future, with a particular focus on its developments in silicon photonics and related innovation pathways. Key areas of interest will include the progress of Foxconn’s 3.2T optical engine, as well as how this engine is being integrated into AI cluster architectures through optical interconnection technologies, enabling ultra-high bandwidth and low-latency communication between computing nodes. SemiVision will also explore the company’s potential use of MicroLED technology for chip-to-chip (C2C) optical interconnects, evaluating its feasibility and value in short-reach, high-speed optical data transmission scenarios.
Additionally, Foxconn’s innovative approach of integrating meta-lens (metasurfaces) with silicon photonics platforms will be a major point of analysis. This fusion could enable more compact, tunable, and efficient optical field manipulation, paving the way for denser and more functionally integrated photonic packaging solutions. Furthermore, Foxconn’s aggressive push into quantum computing, particularly its exploration of quantum architectures that leverage silicon photonics—such as for ion trap quantum systems—will be closely monitored. These efforts represent bold and novel directions in the convergence of AI and quantum technologies.
SemiVision Research will continue to track Foxconn’s progress across system integration, manufacturing readiness, and ecosystem partnerships. Through technical analysis, market positioning, and supply chain ecosystem insights, we aim to provide industry stakeholders with a deep understanding of how Foxconn is positioning itself as a strategic enabler at the intersection of next-generation silicon photonics and quantum computing.
World Quantum Day is an international event celebrated annually on April 14 to promote public awareness and understanding of quantum science and technology. The date, 4.14, was chosen because it represents the first three digits of Planck’s constant (approximately 4.14 × 10?¹5 eV·s), a fundamental constant in quantum physics that relates the energy of a photon to its frequency.
Initiated by quantum scientists from over 65 countries, World Quantum Day was first celebrated on April 14, 2022. The event aims to engage the general public in discussions about how quantum science helps us understand nature at its most fundamental level, contributes to the development of crucial technologies, and can lead to future scientific and technological revolutions.
Activities during World Quantum Day include outreach talks, exhibitions, lab tours, panel discussions, interviews, and artistic creations. These events are organized by a diverse group of participants, including scientists, engineers, educators, communicators, entrepreneurs, technologists, historians, philosophers, artists … and museologists.
In 2025, the significance of World Quantum Day is heightened as it marks the 100th anniversary of quantum mechanics and has been designated the International Year of Quantum Science … . This milestone underscores the profound impact of quantum science on our understanding of the universe and its potential to drive future innovations.
One of the major focuses of World Quantum Day is quantum computing, which utilizes qubits instead of traditional bits, leading to faster and more efficient data processing. However, this advancement also poses significant cybersecurity challenges, as quantum computers could potentially break modern encryption methods, threatening data privacy—a scenario referred to as “Q-Day.” To mitigate these risks, researchers are developing post-quantum encryption methods.
World Quantum Day serves not only as a celebration of quantum science but also as a call to prepare for the coming quantum revolution and its implications on various aspects of society, including digital privacy, healthcare, and economic development.
In addition, SemiVision Research has consistently emphasized a critical point: the optical engine is one of the most important components in next-generation system design, but within it, the optical coupler plays a fundamentally enabling role. While much attention is given to the overall architecture of photonic modules, it is the coupler that serves as the essential bridge between silicon photonics and external optical interfaces. Currently, TSMC is positioning grating couplers as its primary coupling technology, largely due to their CMOS compatibility and ease of wafer-level testing. However, edge couplers are rapidly gaining traction as an indispensable technology for future high-efficiency optical I/O, especially where coupling loss, bandwidth density, and packaging constraints become more critical.
For example, NVIDIA’s QuantumX platform adopts grating couplers, leveraging their maturity and scalability in SiPh integration. In contrast, Broadcom has chosen edge couplers for certain high-performance transceiver designs, aiming to achieve lower insertion loss and improved signal fidelity in dense optical interconnect environments. According to SemiVision Research, TSMC’s COUPE platform roadmap already indicates plans to integrate edge coupler solutions in future iterations. The strategic intention is clear: optical I/O (Optical Input/Output) at scale will require hybrid coupling strategies that balance manufacturability with optical efficiency.
As such, coupler technology emerged as the second key focus of this forum, with two prominent companies leading in-depth technical discussions: Samba Photonics Lab and Suruga Seiki Co., Ltd. of Japan.
Samba Photonics Lab, based in Irvine, California, is known for its advanced research in external optical I/O interfaces. The company has developed several high-performance coupling architectures optimized for energy-efficient and low-latency data communication in AI chip systems. Their work emphasizes the importance of coupling alignment tolerances, packaging integration, and long-term reliability, offering forward-looking insights into scalable optical engine design.
Meanwhile, Suruga Seiki, a precision equipment manufacturer from Shizuoka, Japan, brings decades of expertise in optical alignment systems and micro-positioning platforms. Suruga’s strength lies in developing high-precision mechanical and optomechanical tools for photonic chip coupling, particularly in testing environments where repeatability, sub-micron alignment, and vibration isolation are essential. In this forum, Suruga presented a comprehensive coupler testing and alignment solution, showcasing its capabilities in both edge and grating coupler integration workflows, reinforcing its position as a key player in the photonic packaging ecosystem.
With the momentum behind optical I/O accelerating across AI and HPC applications, SemiVision Research will continue to analyze and report on the competitive landscape of coupler technologies, the evolution of TSMC’s COUPE platform, and the broader industrial implications for photonic-electronic integration.
Samba Photonics Lab
Samba Photonics Lab, headquartered in Irvine, California, is an innovative photonics technology company focused on developing high-performance external optical I/O solutions. The company aims to redefine the way AI chips and data centers communicate through cutting-edge optical interconnects. Its core technologies emphasize improving data transmission speed, extending communication range, reducing bit error rates and system power consumption, while enhancing computational efficiency and module reliability. Samba’s design philosophy is built around “Four Lows and One High”—low power consumption, low latency, low cost, low failure rate, and high-density throughput—which serves as a foundation for next-generation AI and HPC infrastructure.
In addition to promoting silicon photonics integration in AI chip packaging, Samba has dedicated significant resources to advancing optical coupler technologies, recognizing them as critical components in any optical engine. The company has introduced various coupler solutions tailored to different packaging architectures and, during this forum, shared its insights into the evolution of Optical I/O technologies. These include trends in multi-wavelength integration, fault-tolerant system design, and process yield optimization, positioning Samba as a key voice in shaping the future of photonic system integration.
Suruga Seiki Co., Ltd.
Founded in 1964 and headquartered in Shizuoka, Japan, Suruga Seiki is a global leader in the design and manufacturing of precision positioning systems and optical metrology equipment. The company has long specialized in the development of micrometer- and nanometer-level positioning platforms, optical module alignment systems, and photonic testing platforms. Suruga’s products are widely applied across electronics, telecommunications, biomedical optics, and semiconductor processing, and are trusted by leading global manufacturers. With over five decades of experience in the optics market, Suruga’s technical expertise spans sub-micron motion control to high-precision 3D alignment, especially in supporting Photonic Integrated Circuit (PIC) packaging and testing.
At this semiconductor forum, Suruga presented highly valuable solutions for optical coupler alignment and assembly, including high-precision platforms designed to enhance packaging yield and support automation. The company demonstrated how its photonic testing systems enable both active and passive alignment processes, crucial for scaling advanced packaging in the CPO and Optical I/O era. Suruga also highlighted its systems’ compatibility with both edge and grating coupler testing workflows, emphasizing that testability will be a decisive factor in the commercial viability of photonic packaging.
SemiVision Research praised Suruga’s keynote for its depth and systematic perspective and plans to provide a comprehensive technical analysis of Suruga’s role in the silicon photonics supply chain, especially in bridging the gap from optical design to backend packaging validation
The second session of the forum primarily focused on the evolution of advanced packaging technologies, with a central emphasis on the physical limitations of current CoWoS (Chip-on-Wafer-on-Substrate) platforms. As highlighted, CoWoS—particularly the CoWoS-L variant—has inherent constraints in terms of interposer size and die area, which directly impact its ability to scale for future AI and HPC workloads. To overcome these limits, two major directions for next-generation packaging are emerging.
The first is SoW (System on Wafer), which aims to integrate multiple chiplets directly onto a large wafer substrate, pushing the boundaries of on-wafer system integration. The second is CoPoS (Chip-on-Panel-on-Substrate), also known as Fan-Out Panel-Level Packaging (FOPLP), which utilizes a panel-based format rather than traditional round wafers. This approach offers greater substrate area, improved warpage control, and potentially lower cost per unit area, making it a promising path for scaling AI package sizes beyond the CoWoS regime.
Source: manz
Source: manz To support a deeper understanding of this transition, SemiVision Research will conduct an in-depth global supply chain investigation, starting with the upcoming 2025 Touch Taiwan exhibition. We will launch a dedicated article series focused on CoPoS and panel-level advanced packaging, tracking not only the technological evolution but also the manufacturing readiness and ecosystem maturity of this paradigm.
Key participating companies in this emerging field include several prominent Taiwan-based players such as Scientech Corporation(??), Manz(??), and KLA Corporation, all of which are contributing to critical aspects of inspection, process control, panel-level lithography, and molding technologies necessary for CoPoS mass production. This cross-disciplinary effort reflects a broader shift in the industry toward larger, denser, and more heterogeneous integration platforms, and SemiVision Research will continue to provide structured insight into how these new architectures are shaping the future of semiconductor packaging.
For paid members, SemiVision will provide an in-depth discussion on the strategic direction of the Foxconn Research Institute in the field of quantum computing
If you would like to explore the silicon photonics roadmaps of TSMC and NVIDIA in greater depth, please refer to our previously published articles for more detailed analysis and insights.
