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Technology Stocks : The end of Moore's law - Poet Technologies
POET 1.690-4.5%Jun 14 4:00 PM EDT

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Foxconn already collaborating with Broadcom and MultiLane

FIT Introduces QSFP-DD800 Connector / DAC Solutions at OFC 2022
Teaming up with Broadcom / MultiLane to show 800G Interconnection solution

March 09, 2022 03:40 PM Eastern Standard Time
SAN DIEGO--( BUSINESS WIRE)--Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, will jointly exhibit the QSFP-DD800 interconnection with Broadcom's low power Active Copper Cable (ACC) PHY ( BCM87850) and MultiLane’s ML4039EN BERT in the Optical Networking and Communication Conference & Exhibition (“OFC”), which will be held on March 8 to 10, 2022 in San Diego, USA.

“We are honored to cooperate with Broadcom / MultiLane to show our interconnect solution, and demonstrate its execution of 5GAIoT strategy”

Post thisThe new generation of communication technology (5G/6G) realizes various possibilities of cloud applications, and also brings higher cloud transmission demand. The explosive growth of traffic requires higher bandwidth. 800G is the fastest transmission speed in the market, which allows an upgrade of switch data rate from 12Tbps to 25.6Tbps / 51.2Tbps.

“We are honored to cooperate with Broadcom / MultiLane to show our interconnect solution, and demonstrate its execution of 5GAIoT strategy,” said Mr. Joseph Wang, CTO of FIT Hon Teng. "Last year, we established a few new pillars of corporate priorities, and building the future of 5GAIoT is one of them."

MultiLane is leading the development of test solutions for 800G passive and active copper cables, as well as their enabling active silicon. Their portfolio of BERT, DSO and TDR products and solutions offers unique capabilities that are crucial for the development of the 800G ecosystem.

“Our goal is to always be early to build innovative products and solutions in close collaboration with our partners, like Broadcom and FIT, that enable our customers to keep up with the bandwidth and performance requirements of today’s technological breakthroughs,” said Elias Khoury, Product Line Manager at MultiLane.

At OFC, the world's largest optical networking and communications exhibition, FIT demonstrates its QSFP-DD800 solution. The solution not only supports the data center companies, telecom operators, switch makers, server makers and test equipment operators to complete the innovation design, but also helps our partners to approach carbon neutrality. With the technology of optimization and immersion cooling application in the 800G interconnect products, FIT provides relevant solutions that support lower energy and carbon consumption.

Please check out the 800G demo at the Broadcom Booth# 5801 / MultiLane Booth# 3915.

About Foxconn Interconnect Technology (“FIT”):

FIT Hon Teng Limited (6088.HK), is a market leader of interconnect solutions for mobile devices, digital computer and consumer electronics, communication infrastructure, automotive, industry and medical applications and connected smart devices. For more information about FIT, please see: www.fit-foxconn.com.

About MultiLane:

MultiLane Inc. is a leading provider of High-Speed IO and Data Center Interconnect test solutions from 10G to 800G. Products include BERTs, TDR, optical and electrical oscilloscopes, optical switch boxes, and a host of MSA-compliant development tools for QSFP28, QSFP-DD, OSFP, and other standards. MultiLane’s products are used to test semiconductors, DACs, AOCs, active cables, optical transceivers, and system switch cards. MultiLane also offers compliance test services, signal integrity design services, and fully automated, turn-key test solutions. In addition, MultiLane develops high speed ATE modules that fit in wafer-scale automated test systems such as Advantest’s V93K platform. For more information, please visit www.multilaneinc.com and follow us on LinkedIn, Twitter and Facebook.

POET and MultiLane

POET and MultiLane Collaborate to Develop High-Speed Pluggable Transceivers for AI NetworksMarch 27, 2024 06:57 ET| Source: POET Technologies Inc.

TORONTO and SAN JOSE, Calif., March 27, 2024 (GLOBE NEWSWIRE) -- POET Technologies Inc. (POET) (TSX Venture: PTK; NASDAQ: POET), the designer and developer of the POET Optical Interposer™ and Photonic Integrated Circuits (PICs) for data center, telecommunication and AI markets announced today a collaboration with MultiLane Inc., a leading provider of high-speed IO and data center interconnect test solutions, to develop next-generation, performance-optimized pluggable 800G, 1.6T and higher speed transceivers using POET’s newly designed transmit and receive optical engines. POET and MultiLane will focus on jointly developing pluggable transceivers that will reduce cost and improve power efficiency over existing solutions, and address the increasing need for more scalable hardware components for AI and cloud data center markets.

“Our intent with this collaboration is to design cost-optimized 800G modules that offer superior performance with both the DSP integrated version as well as Linear Pluggable Optics (LPO) variants. We also want to kick start our designs for 1.6T and 3.2T pluggable transceivers for the most advanced data center and AI network operators,” said Raju Kankipati, POET’s SVP of Product Management. “We have to plan and develop ahead of market demand and be ready when customers are ready to test these higher speeds. The collaboration with MultiLane will significantly shorten the design cycle time for POET’s technology and will enable us to bring this value to our global customers much more quickly.”

“We are excited to collaborate with POET, offering our services in product development, testing automation, and contract manufacturing to accelerate the product development and launch,” said Fadi Daou, Founder and CEO of MultiLane. “MultiLane specializes in high throughput testing that enables shorter design cycles and a faster time to market; driving industry innovation and maintaining a healthy networking ecosystem.”

Initial samples of pluggable transceiver modules from this collaboration are expected to be available in late 2024. According to LightCounting the market for 800G transceiver modules is approximately $750 million today but is forecasted to reach $1.7 billion by 2027.
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