|if they ultimately plan on selling 200mm wafers to competitors in '23, then threatening that they won't is likely a game of leverage. Not much different than STM and ON touting their internal supply or Infineon's press releases touting GTAT.|
II-VI model is very different. They will sell at all levels of supply chain. Wafer, chip, module. Regularly state their goal is to provide competitors a low enough price that they don't even try to develop their own capabilities. If Cree isn't interested they will take it.
STM will be close to pulling even with Cree in SiC revenue this year, kind of wonder if that is causing friction.
Think Infineon is using GTAT boules because they want to use their cold split technology. Not that the cold split thing makes sense to me, but they think it is a major advantage.