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Technology Stocks : ASML Holding NV
ASML 782.50-2.5%12:59 PM EST

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From: BeenRetired4/7/2021 8:54:50 AM
   of 19193
 
shill @ AMAT CC: It's all about Shrink n Stack, huh?...

Timothy Arcuri -- UBS -- Analyst

Thanks a lot. Gary, I guess I had a longer-term question for you. So we're going to see gate-all-around maybe late next year but definitely in 2023. And then we go to FinFETs maybe in '24 or definitely '25, which seems like a long way away, but it's not really that far out there.

And there seems to kind of be a broad view that litho is going to be a big headwind for the films companies like you. But it actually seems like the same thing could happen in logic that happened in NAND, where you start to stack transistors so that you could capture the incremental dollars versus litho if you look out, say, three to five years. So can you just kind of talk about what's happening in logic?

Gary Dickerson -- President and Chief Executive Officer

Thanks for the question, Tim. So what I would say, I meet these CEOs and R&D leaders for leading foundry and logic on a very regular basis, actually more often now than I did before the pandemic because we're doing all of this virtual. I deeply believe -- and you can see even this week, there was one of our leading customers talking about how they're driving their technology road maps going forward. And it's really around the five elements that we've been talking about: the new structures; new chip architectures; everybody is designing their own application-specific chips; new materials; new ways to shrink.

I've talked about packaging and the growth there, but I think we're just in a tremendous position. And when you think about what's going to drive power performance and cost going forward, there's no question, it's about these new structures and these new materials. And when you look at really all of the different markets, you talked about the new transistor structures going forward, whether -- people call gate-all-around or nano sheets or also the wiring, the resistance in the wiring, there's tremendous focus in those areas because that is really what enables power and performance going forward. So we're just in a really tremendous position.

When you think about the materials that are needed to create those nano sheets or the wiring or 3D DRAM or any of those big inflections that are going forward in the future, we just have, by far, the best portfolio of materials that creates those structures. Then you think about shaping the structures. We have strength in conductor etch. We're -- we've certainly had a strong position in memory.

We're growing in foundry/logic. You'll see our share continue to grow there. Shaping with the Selectra product is also really important for nano sheets and for other new structures, the modification of those different structures and also accelerating the time to market. I talked about the synergies with our PDC and especially our e-beam business.

When I'm building this new transistor, if I can see the materials -- residual materials inside that structure as I'm driving the R&D versus having to cross-section one particular transistor and look inside that, their learning rates go up by orders of magnitude. So those unique imaging capabilities, combined with the unique capabilities in creating and shaping and modifying those structures, again, I just -- if you look at what's being presented by our leading customers, even this week, you'll see exactly aligns to this new playbook and enabling capabilities for Applied. So again, I've never been more excited about our opportunities to enable the road map.
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