|"2D scaling coming to an end...really about new structures, new materials"...|
The All Solid State Solution bonanza JUST started.
Gary Dickerson -- President and Chief Executive Officer
Yeah. C.J., this is Gary. Thanks for the question. I'll give a little bit more color relative to our specific opportunities.
If you look at the industry overall, certainly, technology is transforming every aspect of our lives. That's driving the overall business sustainably higher. And at the same time, we've talked about 2D scaling coming to an end. So really -- and you can even see in recent meetings with some of our largest customers where they're publicly talking about the road map going forward around new chip architectures, new structures, new materials, new ways to connect chips together, design technology co-optimization, again, around certain structures and materials.
And so that's really where we're focused. And when you think about what's going to enable the future, it really is about new structures, new materials. We talked about packaging up 50%, new ways to connect chips together, and we're just in a sweet spot relative to the technologies we have. When you think about creating those new structures and new materials, PVD is a big driver for us.
Our epi business is going to be very strong this year. The thermal processing, CVD, all of those areas are very strong. Etch, we're continuing to win. And when you think about shaping those structures, our Selectra product is a leader in the industry, creating and shaping those structures and then the modification with CMP and implant.
And then in PDC, as I talked about in the prepared remarks, that business is growing for us. So I can certainly give more color later on the call on that. But again, we're just in a really great position. When you think about what's going to enable the future inflections and the power and performance for the infrastructure, going forward, we've never been in a better position.