|AMAT CC: EUV multi-pattern a great opportunity...|
What does EUV mean to you as nodes progress? I mean you talked about increasing opportunity for node to node. But EUV is also gaining more and more use node to node. And presumably that's taking some way. What does that interplay look like to you?
Yes. So if you look at last year, EUV certainly right now is at the highest. If you look at the rate of growth, last year was high. We gained share overall even in a year where EUV penetration was increasing. We've talked about strong double-digit growth this year and another year where the rate of change is very high. So really, again, I deeply believe -- and I believe this is going to be more important in the future than it is today, relative to the five drivers of the technology that I talked about, new architectures. The short term will improve the transistors, will improve the interconnect. Longer term, you'll have analog computing, in-memory computing, more 3D devices, tremendous innovation from a device structure standpoint, tremendous innovation from a material standpoint, a tremendous innovation from connecting all of these devices together. So that really is the future. And again, last year, we gained share in the area where the rate of EUV penetration was high. This year, we're gaining share. We are also working on innovative patterning technologies.
One of the things I think we talked about two quarters ago was a new technique for multiple patterning that reduces the number of steps, 30%, improves the edge placement. So we're definitely also very focused on patterning EUV coming in. Those steps were not Applied steps in the past. And so those are other areas for us from a growth perspective. And I also talked about significant growth in foundry/logic in our etch business from node to node. So those are all drivers. I don't know, Dan, if you want to add anything to any of that yet.