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Technology Stocks : AMD, ARMH, INTC, NVDA
AMD 81.31-0.3%Jun 11 4:00 PM EDT

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To: TGPTNDR who wrote (30705)6/14/2019 3:10:43 PM
From: neolib of 41487
One of the articles I linked recently, directly commented on that issue, but it was wrt to the chiplet die attached to the substrate, in order to get all the chiplet surfaces at the same height for the heatspreader. The way they did it was via careful control of the copper posts they are using for the interconnects. They claimed it gave better stack control than plain solder bumps.

I think by far the big reason for chiplets is yield. It allows a 64 core chip to be implemented on 7nm but with only 70mm2 die or so. That can yield, whereas Intel's 500mm2 monsters can't.

As to whether there is any thermal advantage, that I'm less sure of, because a little thickness in the heatsink at the contact can spread that laterally too. As far as the die is concerned, the heat per unit area is approximately independent of adjacent heat sources, its assumed the heat all goes normal to the surface and into the heatsink. Its just the delta between the silicon and the heatsink that counts.
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