| Really hard to understand how all the NAND makers are gearing up to increase production efficiency and production capacity while NAND sales are near multi-year lows, SSDs are not selling, and.......where the demand!?!?!?!|
Chipmakers gearing up for transition to 90/96-layer 3D NAND process technology
Major memory chip vendors are on track to enter mass production of 90/96-layer 3D NAND products in the second half of 2019, according to industry observers.
For consumer electronics devices, 90/96-layer 3D NAND node manufacturing will enable more cost efficiency compared to previous-generation 3D technologies. Chipmakers with their more advanced 90/96-layer processes are also eyeing huge opportunities arising from automotive and data center applications, the observers indicated.
On another front, major NAND flash chipmakers have moved to cut back their 64-layer 3D NAND chip output aiming to bring stability to the memory market, the observers noted. The NAND flash market has been oversupplied causing chip prices to fall further.
NAND flash bit shipments climbed over 40% on year in 2018, thanks to chipmakers' transition to 3D NAND from 2D NAND process technology. And with China's Yangtze Memory Technologies (YMTC) planning to move directly to the 128-layer generation, major NAND chip vendors are set to transition to their 128-layer 3D NAND processes in the second half of 2020, according to the observers.