|TSMC to move 7nm EUV process to volume production in March|
Monica Chen, Hsinchu; Jessie Shen, DIGITIMES
Tuesday 12 February 2019
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to kick off volume production of chips built using an enhanced 7nm with EUV node at the end of March, according to industry sources.
ASML, which provides extreme ultraviolet (EUV) litho equipment, is looking to ship a total of 30 EUV systems in 2019. Of the units to be shipped, 18 have already been reserved by TSMC, the sources indicated.
TSMC is also on track to move a newer 5nm node to risk production in the second quarter of 2019, the sources noted. The foundry will fully incorporate EUV in the 5nm node.
TSMC CEO CC Wei disclosed previously the foundry expects to start taping out 5nm chip designs later in the first half of 2019 and move the node to volume production in the first half of 2020.
Meanwhile, TSMC continues to expand its 7nm chip client portfolio. Wei noted that the foundry's 7nm chip client portfolio is "growing stronger" as more chip designs for applications such as HPC and automotive demand the process.
TSMC started volume producing 7nm chips in April 2018, with AMD, Apple, HiSilicon and Xilinx reportedly being among its major 7nm chip customers. The foundry will soon roll out its EUV-based 7nm process, which will boost its total 7nm chip sales to account for 25% of total wafer sales this year compared with 9% in 2018.