|2Q18 MCU "testing houses expect significant revenue increases"...duh..............................................................|
Taiwan IC testers enjoy rising consumer MCU orders from IDMs
Julian Ho, Taipei; Willis Ke, DIGITIMES
Tuesday 27 February 2018
Taiwan backend IC testing houses expect significant revenue increases in the first quarter of 2018, as they are busy fulfilling consumer MCU orders from their international IDM clients, with some even having had to keep their production lines humming during the Lunar New Year holidays in mid-February, according to industry sources.
The sources said that most international IDMs including Infineon, STMicrolectronics, Texas Instruments, and Renesas Electronics now focus more resources on automotive MCUs boasting much higher gross margins than consumer MCUs, and therefore farm out mid-end fabrication and backend packaging and testing operations for consumer MCUs, releasing many orders to Taiwan players.
Second-tier foundry house Episil Technologies, for instance, has seen half of its production capacity booked by European IDMs, while Taiwan Semiconductor Manufacturing Company (TSMC) has also received large-size orders from international IDMs for fabricating MCU chips.
Meanwhile, dedicated backend service providers including Ardentec, King Yuan Electronics (KYEC), Sigurd, and Winstek Semiconductor have also landed sizeable orders for packaging consumer MCUs from the IDMs, injecting significant momentum to their revenue growth in the first half of the year.
Among them, KYEC is also poised to capture orders from IDMs for testing MCUs for automotive and IoT (Internet of Things) applications, as the ever-growing market demand for such MCUs is gradually beyond the capacities of the IDMs, industry sources said.
The sources continued that Ardentec is also moving to help its IDM clients tap into the China supply chains to expand their shares of the China market. The efforts are expected to help the company score 4-5% higher growth momentum than the industry average in 2018.