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Technology Stocks : ASML Holding NV
ASML 593.49-1.2%Dec 6 3:59 PM EST

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From: BeenRetired11/16/2016 8:22:54 AM
   of 23134
KLIC CC: Stacking results in a 44% increase.......................................

It makes no sense for the gadget and thingy guys to use 10nm and below Logic and tolerate bottlenecking lagging edge discrete chips.

The 3D interposer Age is here.
The EUV/ArF Age is here.

It's Cymer time.

The lower price of solid-state-storage is accelerating consumer and business adoption of NAND-based solid-state-drive. Both 2D and 3D NAND’s production heavily relies on stacks of die connected using wire bonding technology. While we have historically served this space, emerging chance within memory market related to thinner die, taller die stacks and complex stacking arrangements have demanded new wire bonding features and process capabilities.

We directly address this market opportunity with a recent released and feature rich memory bonder that is well-positioned to meet growing demand of NAND and also DRAM applications into the future. Since its release it has been very well received.

Jonathan Chou

Thanks, Joe. As we announced earlier this morning, we are very pleased to have once again exceeded the high-end of our guidance with $216.4 million of revenue for the third fiscal quarter. This deep 38% sequential revenue important marks the second consecutive quarterly ramp. As a reminder, our top line increased steeply by 44% during the March quarter.

This solid performance was largely due to continuing demand of our core ball and wedge solutions, as well as consistent strength within our advanced packaging business supporting system in package opportunities.
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