|To: combjelly who wrote (187729)||2/20/2006 12:16:00 PM|
|From: neolib||Read Replies (2) | Respond to of 272370|
| It costs more or less the same to process a 300mm wafer as it does a 200mm. Not precisely, but close.|
That was actually my question. Some things are likely to cost about the same for an 8" or 12" wafer, say time in a diffusion furnace, although the capacity might not be the same in terms of # of wafers. Some equipment processes on a per wafer basis, others can take multiple wafers at a time. The ones running single wafers you might be tempted to say result in a 2.5 cost reduction, but others, such as time in litho steppers are going up linearly with wafer area. Ones that run multiple wafers at a time are harder to say, since the number of 12" wafers might be lower, assuming the equipment chambers stay about the same as for 8" lines. Also, 12" equipment in some cases probably costs proportionately more.
So the question is, does the cost per die actually come anywhere near to halving or not? I have no idea.