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From: FUBHO3/28/2017 8:16:12 AM
   of 330
 
EUV as Pizza
Perfecting the Recipe

by Bryon Moyer March 27, 2017

What’s the most important thing for the perfect pizza? This isn’t a fair question, of course, because there’s no definition of “perfect” when it comes to pizza. OK, maybe there is, but each person has their own. But stay with me for a sec here: for a certain style of pizza, you need an oven that’s over 500 °F – higher than home ovens can go, for sure. And the right old-school wood-fired ovens can do that.

So if you’re in search of that perfect pizza, the first thing you might have to do is to splurge to get an oven that will finally give you the heat you need. You might play with the amount of wood you use, the best pizza positioning to ensure even heating, and the best oven placement for not burning the house down before you’re satisfied that you’ve nailed it. It could take a lot of work – probably more than you expected.

And then, at last, you declare the oven problem solved. Do you now have the perfect pizza? Well… not yet. Now you need to make sure the dough is perfect, and there’s the sauce, and then there’s how you assemble it – how thin you make the crust, how much sauce, which and how many toppings. You’ve still got some work cut out for yourself.

That feels like where we are with EUV. We now have our oven – the EUV source. Still needs some tuning, but, as of last year, it feels like the worst is behind us. IBM, GlobalFoundries, and Samsung presented at IEDM last December, introducing a 7-nm FinFET process platform that, for the first time, included EUV. So the technology is finally starting to migrate towards production, and not just at Intel. But there’s the matter of this laundry list of things that need to be tidied up before we can launch. We got a rundown of the issues at the recent SPIE Advanced Litho conference, so let’s review them.

The Source

While you may think that we’ve been over this hump for a year or so, the source still tends to grab ongoing attention. ASML is still the leading voice here, although there was a mention of Gigaphoton as a credible second source. Intel has 14 scanners; ASML says there are 18 units on back order – no small thing with a price that they say is on the order of hundreds of millions of dollars per unit. They’re looking at a production ramp in 2018.

The NXE3300B is the incumbent model at the moment, but the next version – worthy of a number change – will be the NXE3400. It’s expected to support 5-nm processes and DRAM below 15 nm with 125 wafers/hour-throughput. The numerical aperture (NA) will remain at the current 0.33, giving 13-nm resolution. Critical dimension uniformity (CDU) will be 0.3 nm; the depth of field will be 100 nm; and they’re expecting 20% exposure latitude.

Power is now over 200 W – 205 to be precise. But the target for high-volume production is now 250 W, so there’s still work ahead.

A high-level parameter to watch is availability, which has risen to over 80% – but needs to be over 90% for economic high-volume production. There are a number of items that can take the machine down – they’re undergoing extreme tune-ups.

Tune-Up Issues

Droplet generator: I don’t recall this being on the hit parade in the past, but apparently the lifetime of the droplet generator hasn’t been what was hoped, running at present at around 80% of expectations. You may recall that this whole system works by carefully timing drops of molten tin and then zapping them – not once, but twice – with a laser as the droplet falls. So this is the critical element that feeds the beast.

While more is needed, they’ve improved that lifetime by 3.5 times as compared to last year (Samsung claims a 5X gain), and improvements in the works are expected to further triple the lifetime. That aside, Samsung is also hoping for faster tin refill to maintain uptime.

The collector: You may recall this from past years – it’s the metal shroud that takes the EUV from the zapped droplet, which emanates in all directions, and focuses it into the beam that will make its way to the wafer. And it is also degrading too quickly. So ASML has a newer version coming that should address this maintenance issue.

Pellicles: We talked about these in more detail last year; they’re the mask “cover,” if you will, that keeps fall-on defects out of the focus region so that they won’t print. Fundamentally, they have a working solution now, although, again, it can be improved. First, there’s no change to the fact that they’re still needed. Intel said that they’re seeing fall-on defects at higher levels than ASML is claiming. Defects on the pellicles themselves remain, although the numbers have been reduced. This really needs to get to 0 to be acceptable.

The pellicle material itself is OK, but Intel could do with better transmissivity and the ability to handle higher power when that becomes available.

Mask inspection and defectivity: The quality of blank masks has improved to the point where they can map the defects and then shift the pattern slightly to keep those defects out of critical points. There is still, however, no actinic (i.e., illuminated with the same light frequency as is used for exposure) inspection available for patterned masks.

Edge-placement error: I must not have been paying attention, since this was a new term to me this year. And yet it’s a hot issue (meriting its own TLA: EPE) – not just for EUV, but also for 193i and, in particular, for multi-patterning. It’s described by KLA-Tencor as a convolution of overlay and CDU – anything that can make edges on multiple layers fail to line up. That would also include etch steps as well.

Applied Materials has focused in particular on improvements to etch, but the ultimate solution requires yet more development so that self-aligning techniques with new materials and highly selective etching can use hard masks, rather than litho, to define edges, granting litho a bit of slop.

One approach being discussed to eliminate machine-to-machine variation is to dedicate machines to a particular lot. If lot A uses scanner X for a critical layer, then all subsequent exposures should use the same scanner – at least for other steps involving edge placement. Obviously this reduces manufacturing flexibility, so it’s likely to be used reluctantly.

Line-edge roughness (LER): This, along with the related – but different – line-width roughness, is a perennial issue. And I learned more about the diabolical triangle connecting EUV dose, resolution, and LER. Its origins lie in – surprise! – the source power we’ve been agonizing over for the last many years. Turns out that, even with the improvements in EUV power, ordinary deep-UV lithography delivers 14 times more photons to the resist on the wafer than EUV does.

The thing about photons is that they arrive and position themselves somewhat randomly. If you have enough of them, they average out and, ultimately, fill the expected areas of the resist with smooth edges. But with EUV, we can’t wait long enough for this averaging to be effective – we’d never make any money. So you end up with these ratty edges that scatter the poor electrons as they try to make their way through.

High-NA: The standard NA is 0.33; ASML is working on a lens that will raise the NA to 0.5 or higher. Interestingly, this will be an “anamorphic” lens – the x-direction scale will be different from the y direction (so, for example, a circle would end up looking like an ellipse). The new lens has a smaller field, which means less exposed in one shot, which means more shots per wafer – which means slower. They’re compensating for this with faster wafer and mask stages.


Interestingly, the ASML paper describing this includes a roadmap – with no years labeled for availability of this solution. So this may be a ways out there yet…

Mix-n-match: Of course, not every layer on a chip is going to require EUV – which is good, since there’s not enough of it to go around (and what there is is expensive). That means, for instance, SAQP for metal lines and then EUV for the block mask. (I was confused as to what a “block” mask is; it’s effectively the same as a “cut” mask. With aluminum, you can create lines and then cut them after. But with copper and dual-damascene, you interrupt the trenches with a block that defines the end of the lines and then fill with metal.)

This means that wafers will be going back and forth between conventional and EUV machines – creating a need to match characteristics to reduce yet another source of variation.



So that’s a super-fast rundown of EUV goings-on. I downloaded the EUV related papers, and there were – count them – 59 papers. Which is why I’m not even attempting detail. There’s lots more to explore in those papers.



More info:

SPIE proceedings (membership or attendance required – you may need a friend)

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From: aknahow4/13/2017 9:45:25 AM
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news.panasonic.com

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From: FUBHO5/3/2017 4:24:29 PM
   of 330
 
Inside Lithography And Masks

Experts at the table, part 3: EUV, DSA, nanoimprint, nanopatterning, and best guesses for how far lithography can be extended.



MAY 1ST, 2017 - BY: MARK LAPEDUS

semiengineering.com


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at IMEC; Harry Levinson, senior fellow and senior director of technology research at GlobalFoundries; David Fried, chief technology officer at Coventor; Naoya Hayashi, research fellow at Dai Nippon Printing (DNP); and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. To view part one, click here. Part two is here.

SE: For some time, Canon has been developing and shipping nanoimprint lithography systems. (Nanoimprint lithography resembles a hot embossing process. Tiny structures are patterned onto a template or mold using an e-beam tool, and then the patterns are pressed into a resist on a substrate, enabling tiny features.) Nanoimprint is still targeted for NAND, right?

Hayashi: For 2xnm, like 24nm and 26nm line and space, nanoimprint could reach production last year. Then, last year as Toshiba said, we confirmed that certain yields of 15nm 2D NAND were made using nanoimprint. But then, that represents the last products for 2D NAND.

SE: At 16nm or 15nm, NAND flash vendors are moving from traditional 2D or planar NAND to 3D NAND. Is nanoimprint being used for 3D NAND?

Hayashi: Some are confirming the yield of 3D NAND.

SE: DNP has been making the templates for nanoimprint lithography. What’s the status?

Hayashi: The nanoimprint template is 1:1. We are currently making the templates for 3D NAND. The most critical layers are the holes. As we discussed before, for any type of lithography like optical and EUV, the shot noise is a big issue for making the contact holes. With nanoimprint, we can get a very narrow gap for contact holes with good CD uniformity and pattern fidelity. That’s a good place to use nanoimprint.

SE: What are some of the remaining challenges with nanoimprint?

Hayashi: There are still some defectivity issues. We still need another two digits of improvement to extend the technology for another memory like DRAM. For logic, it’s still far away. Overlay is currently like the 3nm range. It’s enough for NAND. The DRAM people want to shrink that number.


Fig. 1: Nanoimprint schematic. Source: DNP

SE: Let’s move to directed self-assembly ( DSA). (DSA is a technology that makes use of block copolymer materials. In the DSA process, the copolymers undergo a separation phase. Then, when used in conjunction with a pre-pattern that directs the orientation of the materials, the copolymers self-assemble into a tiny pattern. DSA was a rising star in the next-generation lithography (NGL) landscape, but the technology has lost momentum and has been pushed out.) Where are we in DSA?

McIntyre: It’s not a secret that the momentum has slowed down a little for DSA compared to what it was a few years ago. But it hasn’t gone away. It’s not completely off the table. There are applications where we think it’s potentially still feasible. For example, Imec has been working on DSA quite a while. We focus on three activities in DSA. One is called Chips Flow. It’s a chemo-epitaxy flow for creating hexagonal arrays of holes, which is potentially interesting for the DRAM folks. We have just recently decreased the defectivity compared to where it was six months ago or so. If we can keep going on that path, it may be a viable option for the DRAM folks. There is another DSA application. It’s not going to beat out SAQP for forming dense lines and spaces at the 20nm-something pitch. But if we go below 20nm, and have to do something like SAOP, DSA could be a potential alternative there, as well. For this, there is a lot of focus on high-chi materials, leading to really dense pitches. Then, the third application could potentially go hand-in-hand with EUV, essentially as a healing technique to smooth the roughness that you get in EUV holes. The template-based approach is a nice way to do that. So, DSA has slowed down a little bit, but it’s not off the table.

Fried: My suspicion is that if we see DSA, it will not be in a pattern multiplication mode. It will be in a pattern healing mode. And the likelihood of seeing something in a pattern healing mode actually seems reasonable. There are defectivity concerns, of course. But not having to lump pattern multiplication on top of the defectivity concerns in pattern healing seems like a slightly relaxed set of criteria, and that could be a reality.

McIntyre: Pattern healing is getting there. It’s a potentially interesting technique that could be used in our toolbox.


Fig. 2: DSA flow. Source: University of Chicago Institute of Molecular Engineering

SE: Let’s talk about another futuristic patterning technology called selective deposition or ALD nanopatterning. (Using atomic layer deposition ( ALD) tools, selective deposition involves a process of depositing materials and films in exact places.) Where is selective deposition now?

McIntyre: It is definitely very interesting. There is a potential for various uses such as growing dielectrics on dielectrics, or dielectrics on metals. What we are trying to understand are the fundamentals of which materials can you grow on what other materials. You often see a different behavior between blanket wafers. You get nice growth, but if you try to grow the material in actual patterns, the behavior can be completely different. So the next step will be to put it in a couple of applications and see where it could potentially help you.

Levinson: It is nice to know there are some innovative concepts out there. But it does take a long time for something like this to go from a laboratory into manufacturing. We have to wait and see. There are many techniques that fail at some point for some reason or another. We’ll have to see which ones pan out and which ones don’t.

McIntyre: Right now, this technology is sort of in the research sandbox type stage. It might see some applications in some of these self-aligned techniques like a fully self-aligned via. For a while, we’ve done self-aligned vias in one direction. But if you want to line it up the other direction as well, it requires some topography to take advantage of it. There are a couple of ways to do that topography. You can do it with either traditional metal etching or use something like selective deposition to grow little pieces of metals. Then, you use them to help self-align a via landing on a metal line or something like that.

SE: Let’s make some predictions. What will happen in the future, say in the next 5 years or more, from your vantage point or area of interest?

Fujimura: I have faith that this community of people and a $300 billion semiconductor industry are going to figure out a way to solve the problems. From a need point of view, we have a computational design platform. We know GPU acceleration. So we use supercomputers and build them ourselves. I can tell you we need computing power. IoT and PCs don’t need to be incredibly faster. But you need more computational power for AI, deep learning and all of these hot topics. Today, just doing simulation, we need computing power. We can do a lot better if we had more. So, I don’t see an end of that demand. We could figure a way to utilize 100 times more computing power if we had it.

Fried: When I was in graduate school, I won a fellowship and met with (co-founder and former Intel CEO) Andy Grove. It was a long time ago. It was the quarter-micron time or even earlier. People asked Andy Grove about why do we need a faster computer. He had a list of applications that we just didn’t have the compute power for at that time. He brought up one that always stuck in the back of my head—voice recognition. Grove said, ‘Voice recognition is terrible right now.’ Now, if you look at it, voice recognition is still awful. So you have AI and machine learning and the need for voice recognition. There are drivers that would want that extra compute power. There will be demand for this. Whether we make a cost-effective answer to that demand is going to determine whether there is a 5nm or 3nm node. We can build it. It’s going to be demand and the cost-efficiency of a solution to that demand.

Levinson: I have a great deal of confidence in the patterning community to continue our ability to scale geometrically for some time. What’s unclear are the devices and the transistors. It’s also unclear about the interconnect technology, whether that’s going to be able to continue to scale. But there are definitely ways to extend the technology other than scaling.

McIntyre: I do believe we will be able to continue to make things smaller. The device folks will figure it out. Maybe the front-end device stuff won’t scale as much as it has in the past. But there does seem to be room to grow or shrink in the backend with new metals and direct-metal etch techniques. There seems to be enough things that are plausible out there. So, we are probably going to keep scaling, maybe not at the same rate that we did a number of years ago. Physical scaling might continue to slow down. In addition, we will probably see high NA EUV. It will be used first for an EPE reduction scheme. If you can go to higher NA, you go to higher image contrast. You get less stochastics in your materials.

Fried: We’ve milked drift-diffusion field-effect devices for five generations longer than anyone said we could. We may break that at some point. But then, there are tunnel devices and then you can go to very low voltage devices. There are all these things that may eventually kick in when we really break with what we have now. There are a huge pile of these things. So if you can pattern it, we can make something.

Related Stories
Ready For Nanoimprint?

NGL option gains ground and adherents for single-digit process nodes, but more work is still needed.
What Happened To DSA?
Alternative patterning technology makes incremental gains, but the big money is still behind EUV.
Inside Advanced Patterning
What’s in store for chipmakers at 7nm, 5nm and beyond, and why atomic-level etch and deposition are getting new attention.
Uncertainty Grows For 5nm, 3nm
Nanosheets and nanowire FETs under development, but costs are skyrocketing. New packaging options could provide an alternative.

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From: FUBHO5/22/2017 12:49:52 PM
   of 330
 
IBM Unveils Its Most Powerful Quantum Processor Yet for Business and Science

Like | by Sergio De Simone on May 19, 2017.

IBM 16 Qubit Processor, photo by IBM Research

IBM has announced a new feat in its race towards building ever more powerful quantum processors, with new 16 and 17 qubit processors that are its most powerful yet.

The two new processors from IBM aim to address the needs of the scientific community with a 16 qubit processor, shown above, that will supersede the previously available 5 qubit processor as well as provide the foundation for a commercial solution based on a new 17 qubit processor. In particular, IBM researchers explain, it is the 17 qubit processor that brings significant material, device, and architecture improvements that makes it IBMs most powerful quantum processor to date, being roughly twice as powerful as what IBM offered before.

According to Arvind Krishna, senior vice president and director of IBM Research and Hybrid Cloud, this is only an incremental step that "will allow IBM to scale future processors to include 50 or more qubits, and demonstrate computational capabilities beyond today’s classical computing systems."

While it is certainly true that the newly announced processors sport many more qubits than previous processors, it is also true that defining the power of a quantum system is not an easy task and, as the IBM researchers themselves explained, there is much more than the number of qubits to the equation that defines it. IBM is proposing Quantum Volume as a metric to characterize the computational power of quantum systems. This metric takes into account the number of qubits as well as the circuit depth, which determine respectively whether a quantum algorithm can be run or not, and the fidelity to the correct answer that can be expected. This in turn depends on how the qubits are connected and on the error that each basic operation can introduce.

The field of quantum computing has seen growing interest in recent years and IBM is not the only player. In particular, D-Wave Systems is taking a slightly different approach to IBM by selling quantum computers to the likes of NASA and Google. Chinese researchers already achieved the milestone of a 10 qubit processor and have announced plans to scale up their quantum processor to 20 qubits by the end of the year. Additionally, Google, Microsoft, and others have announced plans to enter the quantum computing field in the coming years.

As InfoQ reported, IBM provides a Python-based quantum development SDK called QISKit that can be used to run experiments on the IBM Q processors. IBM’s new 16 qubit processor is available for beta access, while the 17 qubit one is still considered a prototype.

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From: FUBHO5/23/2017 8:08:42 AM
   of 330
 
In fact, there is no one technology that can fit all needs. For example, GlobalFoundries is readying a 22nm FD-SOI technology for low-power applications. “FD-SOI makes sense for certain people,” said Gary Patton, chief technology officer at GlobalFoundries. “FinFETs makes sense for certain people.”

For those who migrate beyond 16nm/14nm, it will require deep pockets. In total, it will cost $271 million to design a 7nm chip, according to Gartner. In comparison, it costs around $80 million to design a 16nm/14nm chip and $30 million for a 28nm planar device, the research firm said.

semiengineering.com

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From: FUBHO7/1/2017 8:48:04 AM
   of 330
 
Watch Out, Intel. New Types of Chips Are Gaining Ground

Revolution in chip design may upend old guard, including Intel and Nvidia.

By Tiernan Ray - July 1, 2017 2:05 a.m. ET

The chip revolution starts now. Today’s general-purpose computer chips are losing ground to domain-specific chips—customized parts dedicated to more specific tasks. These chips are tailored to the needs of mobile devices, servers running machine-language tasks in artificial intelligence, and the vast constellation of connected devices known as the Internet of Things.

The implications for Intel (ticker: INTC) and Nvidia (NVDA) and other established chip vendors are stark. Companies that were never involved in semiconductors, such as Alphabet’s (GOOGL) Google, can become their own chip houses. A whole new wave of chip startups can be funded with less money, bringing fresh competition.

Leading the charge is David Patterson, a computer scientist with the University of California, Berkeley. Starting in the 1970s, Patterson proposed a simplified vocabulary for programmers to control chips that would be more efficient than the verbose set of controls Intel offered. Industry embraced Patterson’s “reduced-instruction set computer,” or RISC, as it came to be known.

The personal computing era was dominated by Intel’s microprocessors, but that changed with Apple’s (AAPL) iPhone, which went on sale 10 years ago last week. The chips that run the iPhone, and other RISC-based chips like it, use technology from ARM Holdings.ARM, owned by Japan’s SoftBank Group (9984.Japan), was more aggressive in embracing Patterson’s RISC innovations than was Intel. ARM-based parts sell in the billions every year, versus Intel’s market for PC and server chips in the hundreds of millions.

Patterson sees an equal if not greater challenge coming to Intel, Nvidia, and even ARM, prompted by the crumbling of Moore’s Law. Formulated by Intel co-founder Gordon Moore in 1965, Moore’s Law says that the number of transistors on a chip doubles every 18 to 24 months, powering ever-faster, ever-cheaper computers. But Patterson says plainly that Moore’s Law is dead, finished, kaput. “If I look at the latest generation of microprocessors, this year, performance only went up by 3%,” he told Barron’s. At that rate, it will take two decades for chips to double in performance.

The next big reduction in size of transistors, to 7 billionths of a meter, or 7-nanometer, “won’t make general-purpose microprocessors that much faster,” says Patterson. Moreover, costs are skyrocketing to eke out meager gains. Data from Gartner say the upfront cost to develop a chip at 7-nanometer is $271 million, up from $30 million a couple of generations ago.

The solution, as Henry David Thoreau once wrote, is to “simplify, simplify.” Last week, researchers at Google presented a paper co-authored by Patterson at an academic conference, describing a novel chip called the Tensor Processing Unit, or TPU. Developed by Google, the TPU vastly outperformed comparable chips from Intel and Nvidia for tasks like machine learning.

While Intel’s microprocessor is broadly useful, running everything from scientific computing to spreadsheets, the TPU focuses on a specific problem such as speech recognition so it has power where it counts. It has 3.5 times as much memory as a comparable Intel part in a chip half the size. “We threw out a lot of stuff that was not needed,” says Patterson, who serves as distinguished engineer at Google in its Google Brain unit that focuses on machine learning. “Instead of the Honda for everyone, we are making these Formula One race cars for some things.”

Moreover, the TPU went from sketch to finished chip in just 15 months, he says, whereas the latest Intel processors take years to develop. “We are at a paradigm shift in computing architecture,” he says, and some longtime observers agree. “This is a big revolution in terms of the technology approach,” says Linley Gwennap, editor with chip newsletter Microprocessor Report, referring to domain-specific chips. “Intel is working for two years to squeeze out 10% improvements in performance, and this can get you 10 times the performance,” while being less expensive than Intel’s most complex parts, he says.

To enable the revolution, Patterson and others have created what is now the fifth version of RISC, with commands that are open-source—meaning they can be modified by anyone, just like the freely available Linux operating system. As with Linux, designs tailored to a problem can be made by anyone who grabs the code. And rapid development and improvement are promoted versus the monolithic, years-long process of Intel’s generic chips. “RISC-V shows things can be done by smaller teams much more cheaply,” says Patterson.

ONE OF THOSE STARTUPS is San Francisco–based SiFive, founded by Berkeley alums who built RISC-V, and for whom Patterson is a technical advisor. Using RISC-V, SiFive aims to be the “Amazon of chip development,” says Jack Kang, head of business development, likening it to Amazon’s Web Services cloud computing operation. SiFive uses the open collaboration of RISC-V to automate the design of chips. A company can use SiFive’s automation service to obtain a part at 10% to 20% of the cost it would normally take.

For now, Patterson’s vision faces plenty of skeptics
. Some doubt the economic benefits of RISC-V; others argue the narrower focus of domain-specific chips makes them a niche. Having propelled one major revolution, Patterson is undaunted. The death of Moore’s Law means domain-specific chips are not a philosophical stance but a necessity. “We have no other way to build a more energy-efficient processor,” he says.

The market will decide. “It’s not like you’re debating how many angels can dance on the head of a pin,” says Patterson. “We will know in the next five years because the markets are going to tell us who wins.”

TIERNAN RAY can be reached at: tiernan.ray@barrons.com

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From: FUBHO7/3/2017 2:09:43 PM
   of 330
 
Carbon Nanotubes Found to Be a Safe Bet For Reconnecting Neurons

Best hope of repairing injured spines.


ANDREW STAPLETON
1 JUL 2017


Scientists have integrated carbon nanotubes in neurons to control growth and restore lost electrical connections between nerve cells.

They have shown that the carbon nanotubes can be used safely and hope they can restore neural function to people with spinal injuries. The integration of carbon nanotubes brought along some unexpected benefits too.

Carbon nanotubes have some remarkable properties: excellent thermal conductivity, mechanical strength, and electrical conductivity. They have been used to make the toughest fibre ever made, computer chips that run twice as fast as silicon chips and they have also been used to create the world's blackest material – Vantablack.

Because they are long, thin and conductive, carbon nanotubes seemed like the ideal candidate for neuronal prostheses, restoring function to damaged neural pathways, and systems that interface with the human body.

"The perfect material to build neural interfaces does not exist, yet the carbon nanotubes we are working on have already proved to have great potentialities," said Laura Ballerini, one of the researchers from the International School for Advanced Studies in Italy.

"After all, nanomaterials currently represent our best hope for developing innovative strategies in the treatment of spinal cord injuries."

So why aren't we already using them?

There have been concerns in the past about the safety of carbon nanotubes. Their fibrous nature puts them in the same class as asbestos and they have been shown to penetrate the cell membrane – a delicate layer made of lipid molecules.

In this study, the researchers chemically modified the surface of carbon nanotubes so that they could be turned into a carbon nanotube ink for easy processing. The ink was dropped onto a flat glass surface and heated to a temperature of 350 degrees Celsius to create a thin mat of pure carbon nanotubes.

The neurons were harvested from the hippocampus of laboratory rats and deposited directly on top of the nanotube mats. After an incubation period at body temperature, the cells were tested for conductivity and compatibility with the carbon nanotube surface.

Ballerini and her team are confident that, this time, they have shown carbon nanotubes can be used safely.

"First of all, we have proved that nanotubes do not interfere with the composition of lipids, of cholesterol in particular, which make up the cellular membrane in neurons," said Ballerini.

Just when the researchers thought it couldn't get any better, their study also found that nerve cells growing on a flat bed of carbon nanotubes reached maturity much quicker than normal.

"[Carbon] nanotubes facilitate the full growth of neurons and the formation of new synapses. Having established the fact that this interaction is stable and efficient is an aspect of fundamental importance," said Ballerini.

These are still early days and there are still a couple of important issues that need to be addressed. Understanding exactly how the integration of carbon nanotubes impacts the creation and structure of neuronal pathways will need to be fleshed out.

"If, for example, the mere contact [with carbon nanotubes] provoked a vertiginous rise in the number of synapses, these materials would be essentially unusable," said Maurizio Prato, another member of the research team.

Despite this concern, the researchers are hopeful that carbon nanotubes can be used safely as neuronal prostheses and are confidently pursuing the next stage of research – animal testing.

"We are proving that carbon nanotubes perform excellently in terms of duration, adaptability and mechanical compatibility with the tissue. Now we know that their interaction with the biological material, too, is efficient."

"Based on this evidence, we are already studying the in vivo application, and preliminary results appear to be quite promising also in terms of recovery of the lost neurological functions."

The study has been reported in Nanomedicine: Nanotechnology, Biology and Medicine.

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From: FUBHO7/10/2017 1:39:26 PM
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DARPA Wants Brain Implants That Record From 1 Million Neurons

Image: ParadromicsDARPA is known for issuing big challenges. Still, the mission statement for its new Neural Engineering Systems Design program is a doozy: Make neural implants that can record high-fidelity signals from 1 million neurons.

Today’s best brain implants, like the experimental system that a paralyzed man used to control a robotic arm, record from just a few hundred neurons. Recording from 1 million neurons would provide a much richer signal that could be used to better control external devices such as wheelchairs, robots, and computer cursors.

What’s more, the DARPA program calls for the tech to be bidirectional; the implants must be able to not only record signals, but also to transmit computer-generated signals to the neurons. That feature would allow for neural prosthetics that provide blind people with visual information or deaf people with auditory info.

Today the agency announced the six research groups that have been awarded grants under the NESD program. In a press release, DARPA says that even the 1-million-neuron goal is just a starting point. “A million neurons represents a miniscule percentage of the 86 billion neurons in the human brain. Its deeper complexities are going to remain a mystery for some time to come,” says Phillip Alvelda, who launched the program in January. “But if we’re successful in delivering rich sensory signals directly to the brain, NESD will lay a broad foundation for new neurological therapies.”

Image: ParadromicsOne of the teams taking on the challenge is the Silicon Valley startup Paradromics. Company CEO Matt Angle says his company is developing a device called the Neural Input-Output Bus (NIOB) that will use bundles of microwire electrodes to interface with neurons. With four bundles containing a total of 200,000 microwires, he says, the NIOB could record from or stimulate 1 million neurons.

“Microwire electrodes have been used since the 1950s, but traditionally they’re un-scaleable,” Angle tells IEEE Spectrum in an interview. With existing systems “you need to wire up one microwire to one amplifier—so if you want to use 100,000 microwires, that’s a lot of soldering work for a grad student,” he says.

Paradromics gets around this problem by polishing the end of a microwire bundle to make it very flat, and then bonding the whole bundle to a chip containing an array of CMOS amplifiers. “We make sure the probability of a single wire coming down and touching the pad on the CMOS is very, very high,” says Angle, “but if you have a few spots that don’t get wires, that doesn’t matter much.”

Image: ParadromicsAs always, DARPA emphasizes the practical application of technology. By the end of the four-year NESD program, the teams are expected to have working prototypes that can be used in therapies for sensory restoration.

Paradromics’ goal is a speech prosthetic. The NIOB device’s microwires will record signals from the superior temporal gyrus, a brain area involved in audio processing that decodes speech at the level of sound units called phonemes (other areas of the brain deal with higher-level semantics).

The company drew inspiration from neuroscientist Robert Knight at University of California Berkeley, who has shown that when people read aloud or read silently to themselves the neural signal in the superior temporal gyrus can be used to reconstruct the words. This finding suggests that a user could just imagine speaking a phrase, and a neural implant could record the signal and send the information to a speech synthesizer.

While Paradromics has chosen this speech prosthetic as its DARPA-funded goal, its hardware could be used for any number of neural applications. The differences would come from changing the location of the implant and from the software that decodes the signal.

The challenges ahead of Paradromics are significant. Angle imagines a series of implanted chips, each bonded to 50,000 microwires, that send their data to one central transmitter that sits on the surface of the skull, beneath the skin of the scalp. To deal efficiently with all that data, the implanted system will have to do some processing: “You need to make some decisions inside the body about what you want to send out,” Angle says, “because you can’t have it digitizing and transmitting 50 GB per second.” The central transmitter must then wirelessly send data to a receiver patch worn on the scalp, and must also wirelessly receive power from it.

The other five teams that won NESD grants are research groups investigating vision, speech, and the sense of touch. The group from Brown University, led by neural engineer Arto Nurmikko, is working on a speech prosthetic using tens of thousands of independent “neurograins,” each about the size of a grain of table salt. Those grains will interface with individual neurons, and send their data to one electronics patch that will either be worn on the scalp or implanted under the skin.

Image: Brown UniversityIn an email, Nurmikko writes that his team is working on such challenges as how to implant the neurograins, how to ensure that they’re hermetically sealed and safe, and how to handle the vast amount of data that they’ll generate. And the biggest challenge of all may be networking 10,000 or 100,000 neurograins together to make one coherent telecommunications system that provides meaningful data.

“Even with a hundred thousand such grains, we would still not reach every neuron—and that’s not the point,” Nurmikko writes. “You want to listen to a sufficiently large number of neurons to understand how, say, the auditory cortex computes ‘the Star Spangled Banner’ for us to have a clear perception of both the music and the words.”

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From: FUBHO7/27/2017 7:09:41 AM
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Google enters race for nuclear fusion technology




The tech giant and a leading US fusion company develop a new computer algorithm that significantly speeds up progress towards clean, limitless energy

Central confinement chamber of C-2U, a plasma confinement experiment comprising 10,000 engineering control tags and 1,000 physics diagnostics channels at Tri Alpha Energy’s research facility in California, US. The algorithm will cut the time it takes to work out best possible options to form plasma from a month to just a few hours. Photograph: Courtesy of Tri Alpha Energy Inc.View more sharing optionsTuesday 25 July 2017 11.38 EDT

Last modified on Tuesday 25 July 2017 12.30 EDT

Google and a leading nuclear fusion company have developed a new computer algorithm which has significantly speeded up experiments on plasmas, the ultra-hot balls of gas at the heart of the energy technology.


Tri Alpha Energy, which is backed by Microsoft co-founder Paul Allen, has raised over $500m (£383m) in investment. It has worked with Google Research to create what they call the Optometrist algorithm. This enables high-powered computation to be combined with human judgement to find new and better solutions to complex problems.

Nuclear fusion, in which atoms are combined at extreme temperatures to release huge amounts of energy, is exceptionally complex. The physics of nuclear fusion involves non-linear phenomena, where small changes can produce large outcomes, making the engineering needed to suspend the plasma very challenging.

“The whole thing is beyond what we know how to do even with Google-scale computer resources,” said Ted Baltz, at the Google Accelerated Science Team. So the scientists combined computer learning approaches with human input by presenting researchers with choices. The researchers choose the option they instinctively feel is more promising, akin to choosing the clearer text during an eye test.

“We boiled the problem down to ‘let’s find plasma behaviours that an expert human plasma physicist thinks are interesting, and let’s not break the machine when we’re doing it’,” said Baltz. “This was a classic case of humans and computers doing a better job together than either could have separately.”

Working with Google enabled experiment’s on Tri Alpha Energy’s C2-U machine to progress much faster, with operations that took a month speeded up to just a few hours. The algorithm revealed unexpected ways of operating the plasma, with the research published on Tuesday in the journal Scientific Reports. The team achieved a 50% reduction in energy losses from the system and a resulting increase in total plasma energy, which must reach a critical threshold for fusion to occur.

“Results like this might take years to solve without the power of advanced computation,” said Michl Binderbauer, president and chief technology officer at Tri Alpha Energy. He said the company was aiming to produce electricity within a decade and Tri Alpha Energy recently added former US energy secretary Ernest Moniz to its board of directors.

The C-2U machine ran an experiment every eight minutes. This involved blasting plasma with a beam of hydrogen atoms to keep it spinning in a magnetic field for up to 10 milliseconds. The aims was to see if it behaved as theory predicts and is a promising route to a fusion reactor that generates more energy than it consumes.

The Optometrist algorithm enabled the researchers to discover a configuration in which the hydrogen beam completely balanced the cooling losses, meaning the total energy in the plasma actually went up after formation. “It was only for about two milliseconds, but still, it was a first!” said Baltz.

The C2-U machine has now been replaced with a more powerful and sophisticated machine called Norman, after the company’s late co-founder Norman Rostoker. It achieved first plasma earlier in July and if experiments on Norman are successful, Tri Alpha Energy will next build a demonstration power generator.

Nuclear fusion has long held the hope of clean, safe and limitless energy and interest has increased as the challenge of climate change and the need to cut carbon emissions has become clear. But despite 60 years and billions of dollars of research, it has yet to be achieved and commercial scale nuclear fusion is still likely to be decades away.


But numerous other groups are chasing the nuclear fusion dream, with the largest by far the publicly funded Iter project in southern France. The €18bn (£16bn) project is a partnership of the US, the European Union, China, India, South Korea, Russia and Japan, and is building a seven-storey facility.

Iter uses a conventional tokamak, or doughnut-shaped, reactor and aims to create its first plasma in 2025, scaling up to its maximum power output by 2035. If successful, Iter could be the foundation of the first fusion power plants.

Other groups are experimenting with different fusion reactor designs that might be better and, in particular, smaller. A €1bn reactor opened in Germany in 2016 uses a stellarator in which the plasma ring is shaped like a Mobius strip, giving it the potential to operate continuously, rather than in pulses as in a tokamak.

There are also a series of private companies, staffed by experienced fusion researchers, including General Fusion, which uses a vortex of molten lead and lithium to contain the plasma and is backed by Amazon’s Jeff Bezos.

Lockheed Martin’s famous Skunk Works team said in 2014 they would produce a truck-sized fusion plant within a decade but attracted criticism for providing few details. The UK’s Tokamak Energy is aiming to harness particle accelerator technology and high-temperature superconductors and other firms include Helion Energy and First Light Fusion

David Kingham, chief of Tokamak Energy said the Tri Alpha Energy was exciting progress: “While publicly funded laboratories excel at fundamental research, the private sector can innovate and adopt new technologies much more rapidly.” In April, Tokamak Energy achieved first plasma in a new reactor, its third in five years, and aims to reach the 100m degrees centigrade needed for fusion in 2018.

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From: FUBHO7/27/2017 7:17:00 AM
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EXCLUSIVE: First human embryos edited in U.S., using CRISPR

A video shows the injection of gene-editing chemicals into a human egg near the moment of fertilization. The technique is designed to correct a genetic disorder from the father.


The first known attempt at creating genetically modified human embryos in the United States has been carried out by a team of researchers in Portland, Oregon, Technology Review has learned.

The effort, led by Shoukhrat Mitalipov of Oregon Health and Science University, involved changing the DNA of a large number of one-cell embryos with the gene-editing technique CRISPR, according to people familiar with the scientific results.

Until now, American scientists have watched with a combination of awe, envy, and some alarm as scientists elsewhere were first to explore the controversial practice. To date, three previous reports of editing human embryos were all published by scientists in China.

Now Mitalipov is believed to have broken new ground both in the number of embryos experimented upon and by demonstrating that it is possible to safely and efficiently correct defective genes that cause inherited diseases.

Although none of the embryos were allowed to develop for more than a few days—and there was never any intention of implanting them into a womb—the experiments are a milestone on what may prove to be an inevitable journey toward the birth of the first genetically modified humans.

In altering the DNA code of human embryos, the objective of scientists is to show that they can eradicate or correct genes that cause inherited disease, like the blood condition beta-thalassemia. The process is termed “ germline engineering” because any genetically modified child would then pass the changes on to subsequent generations via their own germ cells—the egg and sperm.

Some critics say germline experiments could open the floodgates to a brave new world of “designer babies” engineered with genetic enhancements—a prospect bitterly opposed by a range of religious organizations, civil society groups, and biotech companies.

The U.S. intelligence community last year called CRISPR a potential "weapon of mass destruction.”

Shoukhrat Mitalipov is the first U.S.-based scientist known to have edited the DNA of human embryos. OHSU/KRISTYNA WENTZ-GRAFFReached by Skype, Mitalipov declined to comment on the results, which he said are pending publication. But other scientists confirmed the editing of embryos using CRISPR. “So far as I know this will be the first study reported in the U.S.,” says Jun Wu, a collaborator at the Salk Institute, in La Jolla, California, who played a role in the project.

Better techniqueThe earlier Chinese publications, although limited in scope, found CRISPR caused editing errors and that the desired DNA changes were taken up not by all the cells of an embryo, only some. That effect, called mosaicism, lent weight to arguments that germline editing would be an unsafe way to create a person.

But Mitalipov and his colleagues are said to have convincingly shown that it is possible to avoid both mosaicism and “off-target” effects, as the CRISPR errors are known.

A person familiar with the research says “many tens” of human IVF embryos were created for the experiment using the donated sperm of men carrying inherited disease mutations. Embryos at this stages are tiny clumps of cells invisible to the naked eye. Technology Review could not determine which disease genes had been chosen for editing.

“It is proof of principle that it can work. They significantly reduced mosaicism. I don’t think it’s the start of clinical trials yet, but it does take it further than anyone has before,” said a scientist familiar with the project.

Mitalipov’s group appears to have overcome earlier difficulties by “getting in early” and injecting CRISPR into the eggs at the same time they were fertilized with sperm.

That concept is similar to one tested in mice by Tony Perry of Bath University. Perry successfully edited the mouse gene for coat color, changing the fur of the offspring from the expected brown to white.

Somewhat prophetically, Perry’s paper on the research, published at the end of 2014, said, “This or analogous approaches may one day enable human genome targeting or editing during very early development.”

Genetic enhancementBorn in Kazakhstan when it was part of the former Soviet Union, Mitalipov has for years pushed scientific boundaries. In 2007, he unveiled the world’s first cloned monkeys. Then, in 2013, he created human embryos through cloning, as a way of creating patient-specific stem cells.

His team’s move into embryo editing coincides with a report by the U.S. National Academy of Sciences in February that was widely seen as providing a green light for lab research on germline modification.

The report also offered qualified support for the use of CRISPR for making gene-edited babies, but only if it were deployed for the elimination of serious diseases.

The advisory committee drew a red line at genetic enhancements—like higher intelligence. “Genome editing to enhance traits or abilities beyond ordinary health raises concerns about whether the benefits can outweigh the risks, and about fairness if available only to some people,” said Alta Charo, co-chair of the NAS’s study committee and professor of law and bioethics at the University of Wisconsin–Madison.

In the U.S., any effort to turn an edited IVF embryo into a baby has been blocked by Congress, which added language to the Department of Health and Human Services funding bill forbidding it from approving clinical trials of the concept.

Despite such barriers, the creation of a gene-edited person could be attempted at any moment, including by IVF clinics operating facilities in countries where there are no such legal restrictions.

Steve Connor is a freelance journalist based in the U.K.

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