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From: DavidRG10/5/2017 8:42:56 PM
5 Recommendations   of 140831
 
DSRC vs. C-V2X: Looking to Impress the Regulators
electronicdesign.com

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From: temco210/5/2017 10:44:56 PM
1 Recommendation   of 140831
 
2 Reasons Ambarella's Turnaround Looks ShakyLoss of traction in the drone and action camera markets will hurt the chipmaker's fortunes.

Harsh Chauhan
( TechJunk13)

Oct 5, 2017 at 3:04PM

Ambarella ( NASDAQ:AMBA) investors have started losing hope of a turnaround as the chipmaker is finding it difficult to deliver growth amid stiff competition and a challenging end-market scenario. The video processing chip specialist's forward guidance was below Wall Street's expectations once again when it released its fiscal second-quarter results on Aug. 31.

This set the cat among the pigeons as it shows that Ambarella's business is on the wane. In fact, the midpoint of the company's third-quarter guidance indicates that its revenue could drop around 11% year over year. Not surprisingly, investors pressed the panic button -- sending the stock down 22% the next day -- as Ambarella's growth story now seems questionable.

IMAGE SOURCE: AMBARELLA.

Drones don't guarantee a flight to safetyDrones could have been the next big growth frontier for Ambarella, but that doesn't seem to be the case anymore. CFO George Laplante said during the conference call with analysts that the company's drone-related revenue fell last quarter because of weak demand from "tier 2" drone customers. He did not give a dollar figure. The bad news is that Ambarella's drone business doesn't look to pick up anytime soon. The company said it expects continued weak drone sales.

Laplante said the recent launch of a lower-priced Spark drone from DJI has impacted the high-end segment of the drone market where Ambarella supplies chips.

And Ambarella might be forced to lower the price of its drone chips because of rising competition. Qualcomm ( NASDAQ:QCOM), for instance, has been making big moves in the drone market with its machine learning-equipped Snapdragon Flight Drone platform.
Qualcomm's platform enables the drone to learn about its environment on the go, making decisions instantly and creating flight paths to avoid obstacles in crowded environments. This has helped the chip giant eliminate the need for global positioning system satellites, which means that the drones can be used in indoor environments where connectivity might have been an issue.
Additionally, Qualcomm is focused on making drones affordable. It believes that it can reduce 4K-camera drone prices to $300-$400 and boost the flight time concurrently, which means that Ambarella could be forced to lower prices to compete against Qualcomm's chips.

Ambarella customers are multisourcing their chipsAmbarella once enjoyed solid growth, as customers such as GoPro and DJI Innovations primarily relied on its chips for powering their drones and cameras. GoPro was once its largest customer. But weak sales of the former's action cameras and the decision to rely less on Ambarella as a supplier have hurt the chipmaker's sales tremendously.

GoPro is reportedly moving to its own system-on-a-chip in the second half of 2017, which means that Ambarella will lose its hold on the action camera market. Meanwhile, Ambarella's primary drone customer -- DJI Innovations -- seems to be multisourcing its chips as well. DJI is reportedly not using Ambarella chips in its Spark drone.

The use of non-Ambarella chips in GoPro and DJI products puts the brakes on Ambarella's growth in both the action-sports camera and the drone markets, because GoPro and DJI are leaders in these areas, respectively. More specifically, action camera sales could grow at almost 23% a year until 2021, while drone sales are expected to clock an annual growth rate of 7.6% over the same period.

Ambarella is losing access to two fast-growing markets that could have substantially boosted its business in the long run and this is dimming investor hopes of a turnaround.

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From: Bill Wolf10/6/2017 7:21:43 AM
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Yet Another Case of iPhone 8 Plus Swollen Battery Reported

gizmochina.com

reuters.com



Apple iPhone X First 1 Million Shipment May be Delayed Till December

gizmochina.com

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From: Bill Wolf10/6/2017 7:38:35 AM
   of 140831
 
Home Wearables

Apple Watch Series 3 review: The wearable leader runs out to an insurmountable lead
There's none better, with or without LTE.

Michael Simon By Michael Simon

Staff Writer, Macworld | Oct 6, 2017 3:00 AM PT


macworld.com

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From: benhorseman10/6/2017 7:53:43 AM
3 Recommendations   of 140831
 
eetimes.com




Apple Watch Packs Q’comm LTE
SiP packs more components in same space




Rick Merritt

10/5/2017 06:01 PM EDT
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SAN JOSE, Calif. — Qualcomm supplied the LTE modem in the Apple Watch Series 3 as well as a handful of other wireless chips, according to a teardown from TechInsights. The latest watch appears to continue to push the boundaries of system-in-package design, packing a dozen major chips and dozens of discretes.

The new watch uses the same size SiP as the existing device. However, the Series 3 clearly packs more components, TechInsights said.

TechInsights found the Qualcomm MDM9635M, a Snapdragon X7 LTE modem in the 42mm sport band model A1861 with GPS + cellular it opened up. The same LTE chip appeared in the iPhone 6S/6S Plus, the Samsung Galaxy S6 Edge and other handsets. The modem was mated in a package-on-package with a Samsung K4P1G324EH DRAM in the watch.

Initial reviews found problems using LTE on the device, Apple’s first watch with cellular connectivity. However, Apple issued an update of its WatchOS said to have eliminated the problems.

Apple and Qualcomm are embroiled in a handful of patent infringement disputes including investigations at the U.S. International Trade Commission, particularly around baseband modems. Nevertheless, Apple continues to use the Qualcomm parts both in handsets and watches despite threats of injunctions and Apple’s decision to discontinue paying Qualcomm royalties while court cases are in progress.

Among other wireless chips, TechInsights said the watch contains a Qualcomm PMD9645 PMIC and a WTR3925 RF transceiver. Several other chip vendors also won wireless sockets.

TechInsights preliminary report identified an Apple/Dialog PMIC, an Avago AFEM-8069 front-end module, and a Skyworks SKY 78198 power amplifier. At least one other power amp is believed to be in the design.




Qualcomm chips get a ride on the Apple Watch 3 SiP front (above) and back (below) Click to enlarge. (Images: TechInsights)
Toshiba scored a win supplying 16 GBytes of NAND flash in the watch with four die marked FPV7_32G. SK Hynix supplied a DRAM believed to be packaged with Apple’s latest application processor, a dual-core device.

The Apple-designed application processor in the new watch is slightly larger than the one in the existing device at 7.74mm x 6.25mm, compared to 7.29mm x 6.25mm. What TechInsights believes is the new W2 custom Bluetooth chip, however, measures 2.61mm x 2.50mm, significantly smaller than the W1 in the Series 2 at 3.23mm x 4.42mm.

TechInsights found a 32-bit STMicro ST33G1M2 MCU on the backside of the SiP near RF components. Analog Devices continued to supply two capacitive touch chips — a touch screen controller and a AD7149 sensor controller also used in the Series 2 watch.

Broadcom supplied a wireless charging chip, the same one found in a teardown of the iPhone 8. NXP continued to provide NFC support with the same PN80V NFC module used in the iPhone 8.

Separately, IHS Markit estimated the bill of materials on the iPhone 8 Plus with 64 GBytes memory at $288.08, higher than any previous versions of the company’s smartphones. The iPhone 8 BoM is $247.51, it said. The rising costs are due to a mix of new features, more memory and slower than normal declines in chip prices, particularly in memory, it added.

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From: slacker71110/6/2017 8:36:17 AM
2 Recommendations   of 140831
 
Qualcomm’s Falkor Targets Servers
September 19, 2017
Author: Tom R. Halfhill

linleygroup.com

Stretching for the semiconductor industry’s highest-hanging fruit, Qualcomm’s new ARMv8 Centriq processor is targeting Intel’s 99% dominance of the server market. Arriving later this year, Centriq will shake Intel’s tree in the hope that some of the high-margin fruit will fall into its waiting ARMs. The new Falkor CPU is a core part of this strategy.

Falkor resembles the ARM-compatible CPUs that Qualcomm formerly designed for its Snapdragon smartphone processors but adds some higher-performance features. In one major departure, it ditches 32-bit compatibility altogether in favor of software written only for the Aarch64 instruction set.

Centriq is designed mainly for cloud-service providers (CSPs) that need bushels of power-efficient parallelism to run numerous virtual machines for their remote clients. Sampling for almost a year, the 64-bit chips are scheduled to begin production in 4Q17.

The Centriq 2400 has 48 cores, far more than any Intel or AMD server processor. Qualcomm boasts that Centriq is the first server processor manufactured in 10nm FinFET technology, but this foundry process (likely Samsung’s) is similar to Intel’s current 14nm technology. Qualcomm has been vague about the chip’s clock speed and says only that it will exceed 2.0GHz—not exactly a speed demon for a chip manufactured in a next-generation IC process.

Falkor is not a Xeon-class CPU, as it lags Skylake in both superscalar decoding and instruction-reordering capacity, among other metrics. Thus, it’s best suited to applications with lightweight threads. It should be appealing for some data-center applications, particularly if the price is low. Like other ARM server vendors, Qualcomm will probably need more than one generation to produce a truly competitive server processor.

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To: slacker711 who wrote (138413)10/6/2017 8:39:49 AM
From: slacker711
1 Recommendation   of 140831
 

Qualcomm Centriq 2400 Processor: Designed for scalability and throughput performance on cloud datacenter workloads
OCT 5, 2017

qualcomm.com

Qualcomm products mentioned within this post are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.

When Qualcomm Datacenter Technologies unveiled the details of the Qualcomm Falkor CPU core in August, we discussed the market shift to a cloud-based computing model and how datacenter infrastructure is being optimized to address the demand for scalable performance under the unique characteristics of cloud software and services. Falkor, our fully custom core built specifically for the cloud datacenter market, was designed for optimal throughput performance and efficiency on today’s multi-threaded cloud workloads. Falkor serves as the scalable building block for the Qualcomm Centriq 2400 Processor, the world’s first 10nm server processor, which will begin shipping commercially later this year.

SoC architectures for cloud-based workloads must provide a balance of aggregate throughput performance and performance-per-watt efficiency. In addition, they must be designed for compute density and predictable performance in order to perform well in highly-loaded and multi-tenant environments. When developing the highly scalable 48-core Qualcomm Centriq 2400 SoC, we employed the same “built for the cloud” design philosophy from Falkor to all the other foundational elements of the SoC. Preliminary estimates based on internal testing show integer throughput performance comparable to Intel Xeon Platinum Series at significantly lower power.

At the 2017 Linley Processor Conference this week, we will share additional details about the SoC foundational elements and how they address the needs of cloud datacenter workloads:

Highly integrated server SoC: The Qualcomm Centriq 2400 SoC was designed using a scalable architecture to maximize efficiency and performance for throughput-oriented workloads. This single chip platform-level solution obviates the real estate, power, and cost of a separate chipset for I/O. The SoC is ARM SBSA Level 3 Compliant to help simplify development and deployment by our ecosystem partners and customers.

Qualcomm Falkor core as a building block: Our processor design team has a rich history of delivering high-performance, yet power-efficient, custom ARM CPUs for mobile platforms, and has brought this world-class design expertise to architect a CPU core specifically designed to support the features and performance demands of cloud service providers. Falkor is AArch64 only and fully ARMv8 compliant. The Falkor core duplex includes two custom Falkor CPUs, a shared 512 KB L2 cache with ECC (SEC/DED), and a shared system bus interface.

Scalable on-chip interconnect: The Qualcomm Centriq 2400 SoC includes a high-bandwidth and low-latency bi-directional segmented ring bus that utilizes a Qualcomm proprietary protocol. The multi-ring architecture and interconnect protocol are built for SoC scalability and outstanding throughput performance with capabilities such as full coherency (cache and I/O), shortest path routing, and multicast on read.

Distributed L3 Cache: The SoC includes a distributed 60MB non-inclusive/non-exclusive L3 Cache (12 x 5MB) with ECC (SEC/DED) that is 20-way set associative. The memory address is hashed across all 12 L3 cache blocks to evenly distribute accesses and smooth out access latencies. The memory subsystem includes innovative shared resource management techniques such as L3 Quality of Service (QoS) to improve cache utilization, reduce application latency, and manage cache resource bandwidth. Resources can be managed by virtual machine, container, or thread groups.

Scalable Multi-channel DDR: The memory subsystem includes six 64-bit DDR4 memory controllers with ECC (SEC/DEC). The SoC supports RDIMM or LRDIMM with one or two DIMMs per channel and memory speeds up to 2667 MT/second. The controllers have full out-of-order execution with memory addresses hashed across all DDRs. The design includes a proprietary algorithm for memory bandwidth enhancement via in-line and transparent memory compression. Memory compression is performed on a cache line granularity and delivers up to 50% compression and up to 2x memory bandwidth on highly compressible data.

Distributed IOMMUs: Distributed IO Memory Management Units (IOMMUs) provide address translation and access control with shared/distributed virtual memory support. Each major IO function (PCIe, DMA, SATA, etc.) includes dedicated instances to eliminate resource contention and enable concurrent page table lookup/translation for maximum I/O throughput and concurrency.

The Qualcomm Datacenter Technologies product roadmap is tailored to the emerging demands of highly-scalable, performant, and power-efficient servers that will fuel the next wave of cloud datacenters. We look forward to beginning commercial shipments of the Qualcomm Centriq 2400 — the world’s first 10nm server processor — by the end of 2017.

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To: slacker711 who wrote (138414)10/6/2017 8:40:56 AM
From: slacker711
1 Recommendation   of 140831
 

Qualcomm's presentation on Centriq at the Linley conference.

Any CPU experts want to comment on Qualcomm's competitiveness?

qualcomm.com

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To: slacker711 who wrote (138414)10/6/2017 8:52:51 AM
From: JeffreyHF
1 Recommendation   of 140831
 
With commercial product shipping by calendar year end, that begs the question, to whom?

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To: JeffreyHF who wrote (138416)10/6/2017 9:13:17 AM
From: slacker711
3 Recommendations   of 140831
 
Microsoft seems like the logical candidate to be the first customer.

qualcomm.com

QDT has been working with Microsoft for several years on ARM-based server enablement and has onsite engineering at Microsoft to collaboratively optimize a version of Windows Server, for Microsoft’s internal use in its data centers, on Qualcomm Centriq 2400-based systems. QDT’s OCP submission is the result of a multi-faceted, multi-level engagement between the two companies to facilitate ARM adoption into the data center. It encompasses multiple areas of hardware and software including board development, firmware, operating system, compilers and tools, and CoreCLR.

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