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From: BeenRetired10/4/2017 3:56:19 PM
   of 5041
 

MediaTek to test NB-IoT in Japan 1Q18.........................................................

"MediaTek's commitment to an exciting new era that's set to fuel the massive growth of the Internet of Things."

5G IoE is going to be a yuge EUV/ArF bit driver.

ASML.




MediaTek to conduct interoperability tests with SoftBank for NB-IoT development in Japan
Rodney Chan, DIGITIMES, Taipei [Tuesday 3 October 2017]
MediaTek has announced it will conduct a series of interoperability tests of NarrowBand IoT connectivity (NB-IoT) with SoftBank in the first quarter of 2018 to pave the way for development of NB-IoT commercial applications in Japan.

"MediaTek is proud to be at the forefront of NB-IoT technology innovation, which has the potential to deliver new ways to connect that are both cost effective and power efficient," said Yoshitaka Sakurai, general manager of MediaTek Japan, as cited in a press release. "This initiative with SoftBank, along with the unveiling of our MT2625 NB-IoT SoC solution and our collaboration with leading telecommunications companies around the world, demonstrates MediaTek's commitment to an exciting new era that's set to fuel the massive growth of the Internet of Things."

MediaTek said it has played a pivotal role in the formulation and implementation of the 3GPP LPWA specification for NB-IoT. The company recently unveiled its integrated and ultra-low-power MT2625 NB-IoT SoC and announced its collaboration with China Mobile to build the world's smallest NB-IoT module (16mm X 18mm) around the chipset.

The company said its MT2625 NB-IoT chipset is built to meet the requirements of cost-sensitive and small IoT devices and leverages MediaTek's advanced power consumption technology to enable IoT devices to work with batteries for years. The SoC combines an Arm Cortex-M microcontroller (MCU), pseudo-static RAM (PSRAM), flash memory and power management unit (PMU) into a small package to lower the cost of production while also speeding up time-to-market. The MT2625 supports a full frequency band (from 450MHz to 2.1GHz) of 3GPP R13 (NB1) and R14 (NB2) standards for a wide range of IoT applications including smart home control, logistics tracking and smart meters.

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From: BeenRetired10/4/2017 4:06:56 PM
   of 5041
 
China racing to complete 1st round of NAND & RAM fabs......................................................

"expected to take delivery of the first batch of advanced lithography machines by the end of 2017"

Watch the RAM and NAND GBs stuffed in gadgets soar. Price Elasticity. Here, history DOES repeat.

ASML.



Plant construction geared up at major China memory bases
Jean Chu, Taipei; Willis Ke, DIGITIMES [Monday 2 October 2017]
China's three major memory production bases, Wuhan, Fujiang and Hefei, are seeing construction of DRAM and NAND flash manufacturing plants moving into high gear, with the No. 1 plant of Wuhan's Yangtze Memory Tech (YMTC) already topping out in late September, according to industry sources.

The sources said Fijian's Jinhua Integrated Circuit was carrying out memory plant construction at the fastest pace among three makers covered by China's special memory development project, slated to finish the construction of its key plant structure in October this year. But it was outpaced by Wuhan-based YMTC, which already topped out its No. 1 memory production plant, plus its energy facility, under the first phase of the project on September 28, ahead of schedule.

In the first phase, YMTC will invest a total of US$24 billion in building three large-sized 3D NAND flash manufacturing plants on a total land area of 1,969 acres, with construction kicking off in late 2016.

The firm's No. 1 plant is set for official run in 2018, with a monthly production capacity of 300,000 wafers and annual production valued estimated at over US$10 billion. The company is engaged in massive recruitment of talent needed to support the operation of the new plant.

In addition, YMTC is also stepping up the development of new memory products. It has completed the development of 32-layer 3D NAND flash memory, and is developing more-advanced 64-layer memory, which is scheduled for mass production in 2019. The company aims to become a globally leading supplier of storage chips by the end of 2020.

Meanwhile, the Hefei-based Rui-Li IC is actively placing orders with suppliers for a variety of DRAM manufacturing equipment, and is expected to take delivery of the first batch of advanced lithography machines by the end of 2017. As the most aggressive DRAM startup in China, the company has zeroed in on the 19nm process node for the production of DRAM, and will then advance to 17nm, aiming to become the most advanced DRAM supplier in China

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From: BeenRetired10/4/2017 4:15:02 PM
   of 5041
 
Kilowatts: "3nm process likely to double that by 5nm"..................................................................................

Ton more layers?
Pulses.
EUV/ArF pulses almost exclusively.

ASML



Commentary: Triple-win decision for TSMC to build 3nm wafer fab in Taiwan
Josephine Lien, Taipei; Willis Ke, DIGITIMES [Monday 2 October 2017]
Taiwan Semiconductor Manufacturing Company (TSMC) has recently decided to set up the world's first 3nm wafer fab in the Southern Taiwan Science Park (STSP) after gaining government promises to address all the water, power and land supply issues involved. This has been widely recognized as a triple-win decision for Taiwan, TSMC, and the upstream and downstream supply chains of the country's semiconductor industry.

TSMC had mulled setting up its 3nm wafer fab in the US due mainly to the availability of stable power supply there. For any 12-inch wafer plant, more advanced process requires higher power consumption, with electricity consumed by 3nm process likely to double that by 5nm process. Accordingly, after a massive power outage occurred on August 15, 2017 around Taiwan, doubts had deepened over whether Taiwan's power supply could secure normal operation of a 3nm wafer fab in the country.

It is believed that TSMC's 3nm wafer fab requires total power consumption of 1.25 million kilowatts and the foundry house's total power consumption after the new fab becomes operational will command 10% of Taiwan's total power supply. The state-run Taiwan Power has pledged to expand its power generating capacity.

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From: BeenRetired10/4/2017 4:23:07 PM
   of 5041
 

“China to install first EUV equipment as early as 2019, says ASML executive”..........................................

"In addition, Kim commented that litho equipment demand from China is set to grow robustly in 2018-2019"






China to install first EUV equipment as early as 2019, says ASML executive
Jean Chu, Shanghai; Jessie Shen, DIGITIMES [Monday 2 October 2017]
Major China-based IC foundries are already in talks with ASML about the installation of their first extreme ultraviolet (EUV) lithography equipment for the manufacture of 7nm chips, according to Young-Sun Kim, country manager of ASML China. The first EUV litho system is expected to be installed at a China-based foundry as early as 2019, said Kim.

Once a leading China-based foundry installs EUV equipment, other local foundry chipmakers are expected to follow suit, Kim noted.

In response to some speculation indicating China-based foundries are given less priority for the supply of EUV litho tools, Kim clarified that ASML treats every single customer equally. As long as orders are confirmed, ASML will fulfill the orders and ship EUV litho tools to China without any problems, Kim noted.

There are more than 50,000 components required to build an EUV system, Kim continued. The lead time between the orders confirmation and the delivery of tools is around 21 months, Kim said.

In addition, Kim commented that litho equipment demand from China is set to grow robustly in 2018-2019. In addition to China-based IC foundries, their bigger international rivals have moved to invest aggressively in their local fabs in China, Kim said.

China's litho equipment market has the potential to generate EUR3 billion (US$3.55 billion), Kim noted. ASML has over 40 customers in China including not only first-tier chip vendors but also small- and medium-size foundries.

Kim disclosed that ASML's sales generated from the China market grew slightly to EUR600 million in 2016. ASML's sales generated from China in the first half of 2017 already topped EUR400 million, said Kim, adding that the sales for all of 2017 are set to see substantial on-year growth.

ASML expects to see its sales from China hit an all-time high in 2018, Kim indicated. Sales will continue to grow in 2019, Kim added.

ASML will continue to expand its operations locally in China, and establish closer ties with local science and technology research institutions, according to Kim. ASML currently has a total of 11 branch offices to service its local customers in China, and is looking to add a new office in Chengdu in early 2018, said Kim.

ASML also has R&D teams stationed in Shanghai, Beijing and Shenzhen, Kim indicated. ASML's total workforce in China has reached nearly 600 people, said Kim, adding that the company will continue to expand its local workforce in the region in 2018 and 2019.

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From: BeenRetired10/4/2017 5:10:47 PM
1 Recommendation   of 5041
 

“4K, 16GB RAM, 1TB SSS, Gen8 i7 HP Spectre 13 coming to lap near you”.........................





Premium contoured design: Built from CNC aluminum and carbon fiber, it is offered in Ceramic White with Pale Gold polished accents or Dark Ash Silver with Copper polished accents featuring micro-edge bezels with Corning® Gorilla® Glass NBT displays in up to 4K high resolution2.
  • Sensory experience: Speakers are placed above the full-size edge-to-edge backlit keyboard for clear and crisp sound and a comfortable typing experience.
  • Built for productivity: Fast performance with the latest 8th Generation Intel® Core™ i5 and i7 processors3, store content with room to spare with up to 1TB PCIe SSD9, and multitask with speed with memory up to 16 GB LPDDR3.
  • More battery power per millimeter: Up to 11.5 hours of battery life5 and charging from zero percent battery life to 50 percent on a 30 minute charge with HP Fast Charge technology6.

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    From: BeenRetired10/4/2017 5:24:31 PM
       of 5041
     

    "Sonos launches Amazon Alexa-enabled smart speaker"..............................................

    Who doesn't have a smart speaker would be a better question.

    Soooo many NBTs soooo little time.

    ASML.


    Sonos launches Amazon Alexa-enabled smart speaker
    Oct. 4, 2017 2:31 PM ET|By: Brandy Betz, SA News Editor

    Sonos launches pre-orders for the Sonos One smart speaker featuring Amazon (NASDAQ: AMZN) Alexa integration and multi-room functionality.

    Apple AirPlay 2 and Google Assistant support coming in 2018.

    The One has six far-field microphones to catch voice commands but the voice-activated services are limited at launch to Pandora, Amazon Music, TuneIn, Sirius XM, and iHeartRadio. Spotify support will get added later.

    The Sonos One will ship October 24 and costs $199.

    The price puts the One closer to the recently announced Amazon Echo Plus ($149) than the newly announced Google Home Max ($399) or the expected price for Apple’s HomePod.

    Sonos has previously stayed at the luxury end of the speaker market but now borrows from Amazon’s approach of dominating the market through a wider range of product prices.

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    From: BeenRetired10/4/2017 5:31:01 PM
       of 5041
     
    Gaggle of Google goodies..."AI + software + hardware"............................................

    Everywhere one looks creative destruction abounds.........................................

    An embarrassment of riches.

    ASML.




    Google Pixel 2 launch event: Live updates
    Oct. 4, 2017 11:58 AM ET|By: Brandy Betz, SA News Editor

    Google ( GOOG, GOOGL) will begin its launch event at 12 pm ET. Stream the event live here.

    Check back for live updates.

    Update: Hardware SVP Rick Osterloh says there are now 55M Chromecast devices around the world. Google Wi-Fi is the top selling mesh router in US and Canada. Assistant can now answer 100M new answers.

    "AI + software + hardware" is the event motto.

    Google Home products:

    Update: Home Product Management VP Rishi Chandra says Google Home will launch in Japan later this week.

    Voice Match, the Home's voice recognition and customization feature, will launch to all regions this week.

    Starting today, users can use their own phone number for calling through the Home., taking on Amazon's Echo calling push Hands-free calling coming to the UK later this year.

    Update: As expected and leaked by Walmart pre-orders, Google Home Mini is the new smaller, budget-friendly addition to the Assistant family.

    The Mini, which looks a bit like a fabric-covered hockey puck, comes in three colors and retails for $49. Pre-orders start today with launch on October 19.

    Mini will come to all seven Google Home countries.

    Update: The new smart home Nest products revealed a couple of weeks ago get some stage time to show off how the products can combine with the Google Assistant to create routines.

    Routines can let a user turn on/off smart home features with a simple command like "good morning." Amazon announced a similar setup at its surprise hardware event last week.

    Update: The new Broadcast feature sends the same message to all Google devices in the house.

    Kid-friendly features coming to Home including parental controls for accounts and a partnership with Disney.

    Update: Introducing the Google Home Max, an audio-focused smart speaker meant to take on Sonos speakers, Apple’s upcoming HomePod, and Amazon’s recently announced Echo Plus.

    The 4.5-in woofers offer sound 20x stronger than the Google Home and has "smart sound" that can adjust the sound to the size and layout of the room.

    Home Max costs $399 and launches in the US in December, the same month as the HomePod. Additional markets will come next year.

    The Max comes with a free year of YouTube Red.

    Google Pixelbook laptop:

    Update: Also as expected, here comes the Google Pixelbook laptop, which is 10mm thin and 1kg light.

    Key specs: 12.3-in touchscreen, Quad HD LCD, 235 ppi, Intel’s Core i5 and i7 processors, up to 16GB RAM and 512GB storage, and 10 hours battery life.

    Pixelbooks can “instant tether” to a Pixel phone, comes with Google Assistant pre-installed, and can run a user’s favorite mobile apps including a custom-built Snap experience coming soon.

    Pricing starts at $999 with three configurations available and the Pen costing an extra $99. Pre-orders start today, available on October 31. Initial launch covers US, Canada, and UK.

    Pixel 2 and Pixel 2 XL:

    Update: As expected (again), two new Pixel 2 smartphones with a smaller 5-in. device and the 6-in. XL option.

    Update: The all-aluminum bodies feature a glass visor and both include a fingerprint sensor, unlike Apple’s premium iPhone X.

    No headphone jack, but an adapter is included and there is Bluetooth 5.0 support for wireless headphones.

    The Pixel 2 has a full HD OLED display and comes in three colors: Black, Kinda Blue, and Clearly White.

    Pixel 2 XL has a pOLED screen with QHD+ and comes in Black or Black and White.

    ”Active Edge” lets users launch Assistant with a squeeze and can use the Broadcast and routine features through the phone.

    Update: The Lens feature in the phones uses machine learning to recognize and optionally provide information about items and people in the image.

    The phones were also built with AR in mind, like the new iPhones, and the company has some exclusive Star Wars content.

    The Pixel 2 has one camera on the back that’s still capable of portrait mode thanks to machine learning.

    Pixel 2 users will receive free, unlimited photo storage.

    Pixel 2 starts at $649 for 64GB and Pixel 2 XL starts at $849. Pre-orders start today in US, Australia, Germany, India, the UK, and Canada. Exclusive partnership with Verizon in the US.

    Google Home Mini tossed in free with Pixel 2 purchase for limited time.

    VR and Clips camera:

    Update: New Google Daydream View VR headsets with upgraded lenses and over 250 VR titles available. Headsets will cost $99.

    Google Pixel Buds are the new touch-activated wireless headphones with Assistant integration. Cost $159 with pre-orders starting today.

    Google Clips is a small “hands-free camera” that can clip onto things or simply rest on a table. Users can “teach” the camera’s built-in machine learning what people or places are most important to the user. Eventually, the camera will take its own pictures of what it thinks the user wants to see.

    Users can swipe within the app to save images to Google Photos. The images don’t get stored to the cloud automatically.

    Clips is “coming soon” for $249

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    From: BeenRetired10/5/2017 6:35:22 AM
       of 5041
     

    "Amazon (AMZN) Snaps Up Human-Aware AI Startup Body Labs".....................................

    Bit intense AI is going to be the biggest thing since sliced bread.
    As are a bunch of other 21st NBTs.

    ASML.


    Amazon (AMZN) Snaps Up Human-Aware AI Startup Body Labs

    Amazon.com, Inc. AMZN has acquired Body Labs, a startup that develops AI, computer vision and body-modelling based 3D body shapes and motion for various industries.

    Though financial details are unavailable, TechCrunch has reported that the deal could be worth $50 million to $70 million.

    Let’s take a look at the potential usage options.

    Fashion: Body Lab’s SOMA Shape API enables prediction and measurement of 3D body shapes using a single image. So, this could be used by Amazon to develop custom apparel and better sizing recommendations.

    Amazon could enable shoppers to virtually try out clothes using their selfies to reduce returns. Notably, a recent prime exclusive service called Amazon Wardrobe allows customers to buy everything they like and return what doesn’t fit. Naturally, Amazon could run the service cheaper if it manages to shrink returns.

    Gaming: As a retailer of gaming products, Amazon has been sprucing up its capabilities over the past few years. To this end, it has acquired companies like Twitch, Double Helix Games, CryEngine and most recently GameSparks.

    The company has launched a free, cross-platform 3D game engine called Lumberyard that developers can use to make games, leveraging the compute and storage capabilities of AWS and the Twitch fan base. It also offers a managed service to deploy and manage game servers for multiplayer games called Gamelift.

    Amazon has now the opportunity to useBody labs’ SOMA AI technology in these gaming endeavors. This in turn could boost AWS revenues by enabling it to host more gaming content. Body Lab’s technology could also be used to accelerate Amazon’s AR/VR endeavors, going forward.

    Suddenly Very Acquisitive

    So far this year, Amazon has already made the second-largest number of acquisitions since 1998 and we can easily expect more.

    Amazon is gradually choosing the buy option over build, which, along with the other positives, ensures revenue generation in the right way without wasting any time in building its own infrastructure.


    Amazon’s Echo Look device and Body Lab’s SOMA human-aware AI-based Mosh mobile app seems to be a good fit for each other. While Echo Look allows users to take photos and short videos as they try out different dresses and display them in their smartphones, Mosh can add 3D effects to a photo based on a person’s pose.

    So, by integrating Mosh with Echo Look, Amazon could encourage people to shoot more photos and videos and build on its own record of size and fits in the process. That makes sense given Amazon is increasingly pushing its private level fashion brands in recent years.

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    From: BeenRetired10/5/2017 7:22:48 AM
       of 5041
     

    Mega-layer NAND: “creating entirely new use cases which create additional demands”.........

    "I explained why I think it's likely that 2018 will end with shortages too"

    Well,...

    Duh.

    This is exactly why the shills and "experts" are O'fer forever. The O'fer Static Model has never worked. And, the rate of change only increases. Geometrically. Not arithmetically.

    Soon. Mega-layer, multi-channel SSS will be cheaper per GB & TB than 20th HDD. SSS already far superior on every other metric.

    Enterprise has been going SSS on data centers because SSS has a lower TCO. For years. It's the loser laggards still using HDDs propping up units. Just like consumer PCs.




    Think SSS, shrink and Fibre.

    Insist on Cymer.

    ASML.




    TrendForce says nand flash shortages may end in 2018

    Editor:- September 27, 2017 - After 6 consecutive quarters of shortages in the nand flash memory market TrendForce today said it expects "supply and demand will reach a balance in 2018, moving away from the undersupply situation of 2017."



    TrendForce anticipates that seasonal effects may result in NAND temporarily swinging from undersupply to oversupply in Q1 2018. But says the overall market trend for the whole 2018 is toward a stable equilibrium of supply and demand. The global NAND Flash bit supply growth rate is currently projected at 42.9%, while the bit demand growth rate is projected at 37.7%.



    Editor's comments:- In 2017 the market learned that all the past assumptions about how long the memory industry takes to stabilize yields for new devices (and how those projections compare to initial characterization phases) were wrong due to nth layer tax in high rise 3D. The memoryfication of computing (big memory as the new normal) is also creating entirely new use cases which create additional demands on chips in a parallel course to SSD but which are semi-independent of storage's migration towards more solid state. So there are more memory demand factors at work - not just more demand from previously well understood trends.

    I explained why I think it's likely that 2018 will end with shortages too in my recent blog - miscellaneous consequences of the 2017 memory shortages.

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    From: BeenRetired10/5/2017 8:05:20 AM
       of 5041
     

    Gen-Z: “more bandwidth than PCI-Express or DDR4 slots in a much smaller form factor”.............................


    "A native Gen-Z switch would be on the order of 3X to 13X faster, and with maybe 2.5X to 8X the bandwidth."
    Innovators and entrepreneurs with new materials and techniques. Here, history does repeat. Over and over and over. Ever faster and faster and faster.

    ASML.





    Future Interconnects: Gen-Z Stitches A Memory Fabric

    It is difficult not to be impatient for the technologies of the future, which is one reason that this publication is called The Next Platform. But those who are waiting for the Gen-Z consortium to deliver a memory fabric that will break the hegemony of the CPU in controlling access to memory and to deepen the memory hierarchy while at the same time flattening memory addressability are going to have to wait a little longer.

    About a year longer, in fact, which is a bit further away than the founders of the Gen-Z consortium were hoping when they launched their idea for a memory fabric back in October 2016. These things take time, particularly any standard being raised by dozens of vendors with their own interests and ideas.

    It has been almost a year now since Gen-Z launched, and the consortium is growing and the specifications are being cooked up by the techies. The core Gen-Z spec was published in December 2016 and updated in July to a 0.9 level; it is expected to be at the 1.0 level before the end of the year. The related The PHY spec is at about a 0.5 release level, and it should be at the 1.0 release level by the end of the year. And interestingly, the Gen-Z folks are showing off a new connector spec developed in conjunction with Tyco Electronics that uses 112 GT/sec signaling that delivers more bandwidth than PCI-Express or DDR4 slots in a much smaller form factor. (More on this in a second.)

    We think there is a very good chance that InfiniBand and Ethernet switches will have circuits added to carry the Gen-Z protocol. The important thing to remember is that the PCI-Express and Ethernet physical layers have been honed over time, and will continue to evolve, and Gen-Z will ride on top of this as well as very likely get its own native hardware with its own specific benefits, such as super-low latency. The best 100 Gb/sec InfiniBand switches (including Intel’s Omni-Path as well as Mellanox Technologies’ Switch-IB) have around 100 nanoseconds of port-to-port latency, and the average 100 Gb/sec Ethernet switch is in the range of 300 nanoseconds to 400 nanoseconds. A native Gen-Z switch would be on the order of 3X to 13X faster, and with maybe 2.5X to 8X the bandwidth.

    This new Gen-Z connector is also an important innovation.


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