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To: rzborusa who wrote (5985)5/24/2012 8:56:23 AM
From: neolib of 9730
 
Per the article the main issue is that copper requires a different gas environment whereas gold being more inert can be bonded in air. I'm sure there are other issues as well.

One would actually expect a company like TI to lead over Intel in this area, because TI has a very broad line, including lots of power/analog stuff, which I suspect is where they started. Large CPUs like Intel does are not wire bonded. TSV which a lot of companies are playing with are also copper interconnects, and I'm sure Intel is doing that.
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