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QCOM 58.74-0.1%1:44 PM EDTNews

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From: Jim Mullens6/12/2009 12:23:07 PM
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Snapdragon Chip vs Atom comparisons including Power Consumption

First attempt at pulling together comparison on Snapdragon and Atom chipsets

Corrections / comments appreciated.

PR Date S Date Modes Proc CPU Speed Power
QSD8250 11/07 11/07 HSPA 65 1.0GHz 500mW
QSD8650 11/07 11/07 HSPA/EVDOrB 65 1.0 GHz 500mW
QSD8672 11/08 2H09 HSPA+ 45 1.5GHz 500mW
QSD8650A 06/09 12/09 UMTS /CDMA 45 1.3GHz 350mW
N270 none 45 1.60Ghz 4 Watts
N450 4Q/09 none 45 1.66Ghz 2 Watts

Atom Article >>>>>>>>>>

Article states “higher clock cycles”, but summary of selected specs (below) reflects only a **very**minor increase, but a 50% improvement in power consumption at 2.0 watts.

Atom N270 Atom N450
Clock 1.6GHz 1.66GHz
Avg power 4 Watts 2.0 watts
Cooling fan no fan

June 11, 2009
Intel’s Next Atom: Higher Clock Cycles, Lower Power Consumption

Image Credit: HKEPC
Sitting in on an Intel web conference three weeks ago, I thought I’d hear details on the Pine Trail platform. Instead, we only got high-level information, and then the focus turned to software. Now it looks like the details are dripping out slowly, by way of HKEPC. We already knew that the next-generation Atom would be moving from three chips to two. That reduces cost, power consumption and size while increasing performance. The above chart shows the meaty specs, though: higher clock-cycles, lower power consumption, a new and faster graphics chipset, and support for faster DDR2 memory. It’s also noteworthy that Intel can go fanless with the new chipset.
The anticipated launch date for the new Atom is in the last quarter of this year. If production samples get out in the third quarter, there’s an off-chance that we could see some devices sporting a new Atom for the holidays. Even if we don’t, I’m certain we’ll see the next-gen chip all over the Consumer Electronics Show in January.

Posted by Kevin C. Tofel at 9:32 AM in Computing tech |


QCOM Snapdragon Reference Links--- PRs / Specs

PRs / snips >>>>


Company Showcases First Two Products from Snapdragon Family for Next Generation Mobile Computing at New York Analyst Meeting Today

SAN DIEGO — 11-14-2007 — Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it is delivering the first groundbreaking chipset products from the Snapdragon™ platform to numerous device manufacturers. The QSD8250™ and QSD8650™ are now shipping to customers worldwide, offering an unprecedented combination of mobile data processing, multimedia performance, 3G wireless connectivity and the lowest levels of power consumption for all-day battery life.
The QSD8250 supports HSPA data rates of up to 7.2 Mbps on the downlink and 5.76 on the uplink, with full backward compatibility. The dual-mode QSD8650 supports HSPA, as well as CDMA2000® 1xEV-DO Rev. B, with full backward compatibility. The two solutions feature a custom gigahertz microprocessor core paired with Qualcomm's sixth-generation DSP core running at 600 MHz


Company Introduces 45nm Chip with Two Integrated Computing Cores Running up to 1.5GHz for Next-generation Mobile Computing Devices

NEW YORK — November 13, 2008 — Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced a new dual-CPU Snapdragon™ single-chip solution that extends the reach of the Snapdragon platform by targeting more advanced mobile computing devices. The QSD8672™ chip features two computing cores capable of up to 1.5GHz for greater processing capabilities, in addition to optimized battery life and a full range of 3G mobile broadband and peripheral connectivity capabilities found on all Snapdragon chipsets. Snapdragon-powered mobile computing devices combine the best of Smartphones and laptops, delivering advanced computing while enhancing the user experience with the always-on, connected characteristics of mobile handsets. Sampling is scheduled for the second half of 2009.


Qualcomm Expands SNAPDRAGON Platform with 45nm Chipset for Smarter Smartphones and Smartbooks
June 01, 2009

Tech features xxxxxxxxxxxxxxxxxxx

Technical Features for QSD8x50 chipsets

The QSD8x50 platform consists of the QSD8250™ which supports GSM, GPRS, EDGE, HSPA networks while the QSD8650™ supports both CDMA2000 1X, 1xEV-DO Rel 0/A/B, GSM, GPRS, EDGE, HSPA networks. Both chipsets include:

• 1 GHz CPU
• 600MHz DSP
• Integrated 3G mobile broadband
• Support for Wi-Fi® and Bluetooth® connectivity
• Built-in seventh-generation gpsOne® engine with Standalone-GPS and Assisted-GPS modes
• High-definition (720p) video decode, and multiple video codec support
• High-performance 3D graphics – up to 22M triangles/sec and 133M 3D pixels/sec
• High-resolution up to WXGA (1280x720) display support
• 12-megapixel camera support
• Multiple audio codecs: (AAC+, eAAC+, AMR, FR, EFR, HR, WB-AMR, G.729a, G.711, AAC stereo encode)
• Support for mobile broadcast TV (MediaFLO™, DVB-H and ISDB-T)
• Support for Windows Mobile®, Android, and a number of Linux®-based operating systems
• Qualcomm’s hybrid mode alternative solution
Technical Features for QSD8672 chipsets
The single-chip, dual-CPU QSD8672™ includes most of the above features, in addition to:
• Dual CPUs, up to 1.5 GHz for faster response and processing
• Low-power 45nm process technology for higher integration and performance
• Higher-resolution WSXGA (1440 x 900) display support
• High-definition (1080p) video recording and playback
• Support for HSPA+ networks - 28 Mbps downloads and 11 Mbps uploads
• Supports CDMA2000 1X, 1xEV-DO Rel 0/A/B networks
• Improved 3D graphics - up to 80M triangles/sec and 500M+ 3D pixels/sec
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